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<title><![CDATA[EC21 Product Catalogs - sic plates]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/sic_plates--2673/1/sic plates.html]]></link><item>
<title><![CDATA[Heat Sinks,Al-SiC,Electronic Packaging Materials,Thermal Pad,Aluminum Composite Material]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Heat_Sinks_Al_SiC_Electronic--12057378_12057548.html]]></link><description><![CDATA[plates. Integrating the heat sink and base plate reduces thermal resistance and cost.
AlSiC’s structure combines the low thermal expansion of SiC with the thermal conductivity of Al, allowing stabl]]></description><pubDate><![CDATA[20260522]]></pubDate></item>
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<title><![CDATA[Drawer Oil Retaining Ring 4GA14276]]></title><link><![CDATA[https://yoyik456.en.ec21.com/Drawer_Oil_Retaining_Ring_4GA14276--11988505_11996635.html]]></link><description><![CDATA[plate parts 0508.1161T0103.AW031
turbine Emergency pump thrust bearing 125LY-23
electric motor centrifugal water pump DFB-100-80-230
stainless steel Throttle valve (flange) 40BJ-1.6P
Drawer oil retai]]></description><pubDate><![CDATA[20240902]]></pubDate></item>
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<title><![CDATA[AccuThermo AW 610M Rapid Thermal Annealing]]></title><link><![CDATA[https://allwin21.en.ec21.com/AccuThermo_AW_610M_Rapid_Thermal--9759759_9763382.html]]></link><description><![CDATA[SiC and other valuable compound material wafers .
Wafer Size: 2 to 4 inch or 3~6 inch, Silicon wafers. Use 3″/4″/6″ Susceptor or wafer carriers for small samples, compound material (GaAs , InP ]]></description><pubDate><![CDATA[20240514]]></pubDate></item>
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<title><![CDATA[Convoluted Grinding Wheel]]></title><link><![CDATA[https://dodotrad.en.ec21.com/Convoluted_Grinding_Wheel--828272_1259329.html]]></link><description><![CDATA[rust and deburring
-steel, hair line of stainless, etc.
Dimension;
diameter ; 150 mm ~ 500mm
thickness ; 15 mm ~ 630 mm
Hardness ; S, M, H
grit (grade) ; #80 ~ #800
grain ; SiC , GC, A/O, WA.
]]></description><pubDate><![CDATA[20160212]]></pubDate></item>

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