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<title><![CDATA[EC21 Product Catalogs - top exposure unit]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/top_exposure_unit--2673/1/top exposure unit.html]]></link><item>
<title><![CDATA[Wet Metal Chemical Etching Machine and PCB Etching Machine]]></title><link><![CDATA[https://wetetching.en.ec21.com/Wet_Metal_Chemical_Etching_Machine--11869945_11869948.html]]></link><description><![CDATA[exposure process.
Dissolve and remove the photoresist other than those required and form a pattern image of the photoresist.
There is a “soaking method” of immersion in the developer and a “spr]]></description><pubDate><![CDATA[20231124]]></pubDate></item>

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