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<title><![CDATA[EC21 Product Catalogs - vacuum conductance]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/vacuum_conductance--2673/1/vacuum conductance.html]]></link><item>
<title><![CDATA[Copper Heat Pipe Vacuum Tube Aluminum Skiving Fin Heat Sink]]></title><link><![CDATA[https://bythermal.en.ec21.com/Copper_Heat_Pipe_Vacuum_Tube--12049108_12050587.html]]></link><description><![CDATA[What is a Heat pipe Heatsink?
A Heat pipe is a sealed copper tube that is under vacuum, and can transfer heat rapidly away from the source. The High thermal conductivity enables a heat pipe to transf]]></description><pubDate><![CDATA[20250321]]></pubDate></item>
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<title><![CDATA[9MB Electrode for Semiconductor Coating]]></title><link><![CDATA[https://reframetals.en.ec21.com/9MB_Electrode_for_Semiconductor_Coating--12016380_12041517.html]]></link><description><![CDATA[conductor coating processes, whether it’s chemical vapor deposition (CVD) or physical vapor deposition (PVD), in various complex reaction environments such as high temperatures, high vacuum, or spe]]></description><pubDate><![CDATA[20250206]]></pubDate></item>
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<title><![CDATA[Vacuum Arc Remelting Furnace]]></title><link><![CDATA[https://und24.en.ec21.com/Vacuum_Arc_Remelting_Furnace--12009016_12009038.html]]></link><description><![CDATA[Vacuum Arc Remelting Furnace(VAR/RVAR)
Product Features
Vacuum Arc Remelting Furnace The entire furnace head is designed as a self-supporting structure without any building support;
Coaxial conductiv]]></description><pubDate><![CDATA[20240924]]></pubDate></item>
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<title><![CDATA[VJFB Series  Industrial Explosion Proof Dust Collector]]></title><link><![CDATA[https://villo.en.ec21.com/VJFB_Series_Industrial_Explosion_Proof--11671382_11671389.html]]></link><description><![CDATA[Vacuum Dust Collector
Model
VJFB-1.5
VJFB-2.2
VJFB-3.0
VJFB-4.0
VJFB-5.5
VJFB-7.5
VJFB-11
VJFB-15
Voltage (V/Hz)
380 / 50
Power(kW) / (HP)
1.5 / 2.0
2.2 / 3.0
3.0/4.0
4.0 / 5.5
5.5 / 7.5
7.5 / 10
11 ]]></description><pubDate><![CDATA[20221110]]></pubDate></item>
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<title><![CDATA[FITVAC Solution]]></title><link><![CDATA[https://vsl2121.en.ec21.com/FITVAC_Solution--11835707_11835778.html]]></link><description><![CDATA[Vacuum pipe conductance evaluation : Check of inefficiency pipe elements
• Vacuum pump capacity evaluation : Check of the optimal pump capacity
• System optimzation(After improvement)
: Improve t]]></description><pubDate><![CDATA[20231231]]></pubDate></item>
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<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[The company&apos;s main business scope:1. Technology development, assembly and sales of semiconductor automation equipment; existing new development equipment: MINILED glue injection film press integrated]]></description><pubDate><![CDATA[20230903]]></pubDate></item>
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<title><![CDATA[Lamination Press]]></title><link><![CDATA[https://jinminpeng.en.ec21.com/Lamination_Press--11402096_11407605.html]]></link><description><![CDATA[vacuum laminating machine for multilayer PCB makingFunction:1). Nominal pressure: 1200KN~18000KN2) Number of layer: 4~20layer3). Heating way: Oil of heat conduction4). Precision of pressure control: ]]></description><pubDate><![CDATA[20210628]]></pubDate></item>
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<title><![CDATA[Vacuum Lamination Press]]></title><link><![CDATA[https://martinj.en.ec21.com/Vacuum_Lamination_Press--11785468_11785825.html]]></link><description><![CDATA[vacuum lamination press for multi-layer PCB
Function:
1). Nominal pressure: 1200KN~18000KN
2) Number of layer: 4~20layer
3). Heating method: Heat conduction oil
4). Pressure control accuracy:+/-0.15 ]]></description><pubDate><![CDATA[20230521]]></pubDate></item>

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