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<title><![CDATA[EC21 Product Catalogs - wafer level package]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/wafer_level_package--2673/1/wafer level package.html]]></link><item>
<title><![CDATA[WDW-S01/02/05 Electronic Tensile Testing Machine]]></title><link><![CDATA[https://shiyanji.en.ec21.com/WDW_S01_02_05_Electronic--4048548_4096469.html]]></link><description><![CDATA[package, geotextile, film, wood, paper and other manufacturing industries and quality supervision department. It is also used in colleges for teaching demonstration.
&amp;acirc;&amp;Acirc;&amp;Acirc;&amp;Acirc;&amp;Acir]]></description><pubDate><![CDATA[20120515]]></pubDate></item>
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<title><![CDATA[Baking Dry Cabinet]]></title><link><![CDATA[https://raingoal.en.ec21.com/Baking_Dry_Cabinet--9489546_5421362.html]]></link><description><![CDATA[packages to comply with IPC/JEDEC J-STD-033C. 
Features
Advanced ultra-low humidity technology, effective thermal insulation to make the energy consumption the lowest.
Dry units: 2%~50%RH.
Heater: Ro]]></description><pubDate><![CDATA[20150428]]></pubDate></item>
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<title><![CDATA[Ultra Low Humidity Dry Cabinet for MSD IPC/JEDEC J-STD-033]]></title><link><![CDATA[https://eurekamarketing.en.ec21.com/Ultra_Low_Humidity_Dry_Cabinet--9213141_9213204.html]]></link><description><![CDATA[packages and components. 
Printed Circuit Boards are hygroscopic. Absorbed moisture will lead to delamination in PCB when moisture inside the layers causes expansion during the reflow process.
Moistu]]></description><pubDate><![CDATA[20181025]]></pubDate></item>

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