EC21 Product Catalogs - wafer thinning

AW-1008 Plasma Asher Semiconductor Process Equipment

20240514

Manufacturer: Allwin21Condition: NewWafer Size: 3″ – 6″ CapabilityWafer Loading: 3-axis Robot wafer transfer (Video)Plasma Power: MicrowaveType: Parallel/Single Wafer Process; Stand-AloneGas Li

Automatic Rolled Sugar Cone Baking Machine

20220727

The machine can make sugar rolled cone, egg roll, round thin biscuit, wafer biscuit and bowl-shaped cup. We can design different baking machine to make different types of sugar rolled cones as requir

Wafer Pre Aligner

20130319

Wafer Pre Aligner Feature - Wafer Size (2inch ~ 18inch) - Notch, Flat Wafer, Ring Type, Thin Wafer (50um) - Si, Glass, Film, Sapphire - Compact Size - Fast Alignment (< 3.5sec) - High Performance Ac

Wafer Back Grinding Wheel

20230427

Wafer Back Grinding Wheel Leading technology Good self-sharpening No dressing required High yeild rate of work-piece Applications of Wafer Back Grinding Wheel Used for wafer's back thinning in LED an

Robot Gripper for Handling 3C Flat Parts,Robot Gripper, Robotic Clamps

20230226

wafers, and thin glass assembly, sorting, testing, packaging and other processes of workpieces; The grasping action of the flexible gripper is inspired by the tentacles of an octopus, which can softl