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<title><![CDATA[EC21 Product Catalogs - 1 chip]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/1_chip--10120399/1/1 chip.html]]></link><item>
<title><![CDATA[Xwitzeal Q1 PCB Chip Grinding Machine]]></title><link><![CDATA[https://17169962783.en.ec21.com/Xwitzeal_Q1_PCB_Chip_Grinding--11978786_11978789.html]]></link><description><![CDATA[Description:Xwitzeal Q1 CNC Grinder Automatic Chip Grinding Machine for mobile phone motherboard, CPU, touch screen IC, iPhone Nand flash, BGA chips grinding and phone frame/camera ring cutting polis]]></description><pubDate><![CDATA[20240801]]></pubDate></item>
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<title><![CDATA[Customized OEM ODM Service, Aluminum Substrate Board, Fiberglass Board, LED PCB, FR4, Design Drawing]]></title><link><![CDATA[https://smarled.en.ec21.com/Customized_OEM_ODM_Service_Aluminum--12069600_12069978.html]]></link><description><![CDATA[chips work stably for a long time at the critical temperature.
5) High precision circuit layout, well-organized circuit, achieving complex circuit control.
Mob/Whatsapp: +86 157 6641 6661
E-mail: dal]]></description><pubDate><![CDATA[20260419]]></pubDate></item>
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<title><![CDATA[Air Compressors Board Electronics PCBA PCB Assembly -Contract Manufacturing]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Air_Compressors_Board_Electronics_PCBA--4357166_4361360.html]]></link><description><![CDATA[1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[LED Aluminium PCBA]]></title><link><![CDATA[https://avpcb.en.ec21.com/LED_Aluminium_PCBA--12017667_12017675.html]]></link><description><![CDATA[1. Advanced Thermal Management
LEDs generate heat during operation, which can impact their efficiency and lifespan. We utilize high thermal conductivity materials, such as aluminum, in our PCB design]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[40001339 Juki 501 Nozzle]]></title><link><![CDATA[https://beckysu.en.ec21.com/40001339_Juki_501_Nozzle--8604216_8603598.html]]></link><description><![CDATA[1.7
PAD TYPE
E3660-729-000
#506 TIP
Φ5.0/Φ3.2
PAD TYPE
E3661-729-000
#507 TIP
Φ8.5/Φ5.0
PAD TYPE
E3662-729-000
#508 TIP
Φ9.5/Φ8.0
PAD TYPE
CHUCK NOZZLE
CHIP SIZE LARGE
CHUCK NOZZLE
CHIP SIZE SM]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Rice_Milling_Machine_PCB_Assembly--11194245_11194269.html]]></link><description><![CDATA[1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
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<title><![CDATA[Samples 2 Layer PCB Pcba Service Board Manufacturer Electronic Assembly PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Samples_2_Layer_PCB_Pcba--11408756_11578332.html]]></link><description><![CDATA[​ Below description help you to know more about PCB Assembly 
Type of Assembly
SMT,Thru-hole, DIP
Solder Type
Water Soluble Solder Paste,Leaded and Lead-Free
Components
Passive Down to 0201 size
BG]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[SCM200 M2M Chip Personalization Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/SCM200_M2M_Chip_Personalization_Machine--11883003_11883025.html]]></link><description><![CDATA[chip manufacturers, and can flexibly and quickly switch production orders of different packaging forms.
Specifications of SCM200 M2M Electronic Chip Making Machine
PARAMETER
Overall Dimension
1250mm]]></description><pubDate><![CDATA[20240103]]></pubDate></item>
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<title><![CDATA[Custom High Precision Electronic SMT PCB Assembly Service]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Custom_High_Precision_Electronic_SMT--10919275_11050436.html]]></link><description><![CDATA[1 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-tes]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Original Electronics Component Logic IC Chips SOT23-5 SN74LVC1G125DBVR]]></title><link><![CDATA[https://hknovatech.en.ec21.com/Original_Electronics_Component_Logic_IC--11889683_11890223.html]]></link><description><![CDATA[Video Description:10
00:45
Original electronics component Logic ic chips SOT23-5 SN74LVC1G125DBVRModel NumberSN74LVC1G125DBVRBrief Description100% New and originalManufactureoriginalDate codenewPacka]]></description><pubDate><![CDATA[20240118]]></pubDate></item>
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<title><![CDATA[High Volatge PCB Circuit Board for LED Bulb  LED Down Light]]></title><link><![CDATA[https://ecobrightnancy.en.ec21.com/High_Volatge_PCB_Circuit_Board--9781153_9787123.html]]></link><description><![CDATA[2835 5730 China Aluminum LED PCB, SMD LED PCB Circuit Board for LED bulb led down light 
1.Voltage : AC100V-240V , DC12V/24V 
2. Wattage : 3W ,5W .7W 9W 12W 15w , 18w , 20w ,24w 
3.Epistar SMD chip ,]]></description><pubDate><![CDATA[20151211]]></pubDate></item>
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<title><![CDATA[Ceramic Substrate,Ceramic PCB,Ceramic Metallization,AlN,Al2O3,Direct Plating Copper,DPC,DBC,Ceramic]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/Ceramic_Substrate_Ceramic_PCB_Ceramic--11797353_11797373.html]]></link><description><![CDATA[chip substrate
The integration of the thin film,thick film,electrode plating and electroless plating processes
Application: 
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication &amp;]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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