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<title><![CDATA[EC21 Product Catalogs - Chip Process Line]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/Chip_Process_Line--10120399/1/Chip Process Line.html]]></link><item>
<title><![CDATA[Printed Circuit Board Assembly(PCBA)]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/Printed_Circuit_Board_Assembly_PCBA--12069958_12069959.html]]></link><description><![CDATA[process
Surface Mount Technology
• Surface-mount component mounting, including chip components, ICs, BGAs, and QFNs.
• Solder paste printing → component mounting → reflow soldering.
DIP(Throu]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Alumin]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Home Use Diesel Generator Printed Circuit Board Assemblies - Grande Electronics]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Home_Use_Diesel_Generator_Printed--4357166_4357168.html]]></link><description><![CDATA[Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Alumin]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Semi-Auto Strapping Machine PCBA | Assembled Printed Circuit Boards]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Semi_Auto_Strapping_Machine_PCBA--11194245_11194246.html]]></link><description><![CDATA[Processed： 0402, 0603, 0805, 1206, 1608, 2125, 3216 Micro QFP 0.2mm Flip-chip, BGA, Connectors BGA Ball Pitch=0.2mm 9, Each workstation in accordance with the SOP 10, Materials：FR-4, FPC, Aluminu]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[line distribution using micro-bumping. The HDI PCB assembly manufacturing
has an inner layer line and an outer layer line, and uses a process such as drilling and metallization in the hole to connect]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Pcba Service for Elevator/Lift Controller PCB Assembly Board Custom Made Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Pcba_Service_for_Elevator_Lift--11408756_11409542.html]]></link><description><![CDATA[lines, 2 DIP lines, 2 assemble lines, 1 function test line and 1 box building assembly line. Testing includes AOI, X-ray inspection, ICT test, and aging testing. For electronic contract assembly, adv]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
<item>
<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line o]]></description><pubDate><![CDATA[20230821]]></pubDate></item>

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