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<title><![CDATA[EC21 Product Catalogs - Chips Process]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/Chips_Process--10120399/1/Chips Process.html]]></link><item>
<title><![CDATA[Printed Circuit Board Assembly(PCBA)]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/Printed_Circuit_Board_Assembly_PCBA--12069958_12069959.html]]></link><description><![CDATA[process
Surface Mount Technology
• Surface-mount component mounting, including chip components, ICs, BGAs, and QFNs.
• Solder paste printing → component mounting → reflow soldering.
DIP(Throu]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Alumin]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Magnetics for Power Electronics Converters Circuit Board Assembly (PCBA)]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Magnetics_for_Power_Electronics_Converters--4357166_4361405.html]]></link><description><![CDATA[Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Alumin]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[LED Aluminium PCBA]]></title><link><![CDATA[https://avpcb.en.ec21.com/LED_Aluminium_PCBA--12017667_12017675.html]]></link><description><![CDATA[chips and electronic components is vital for achieving optimal performance. Our experienced team works closely with you to identify and source high-quality, compatible components tailored to your spe]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[Semi-Auto Strapping Machine PCBA | Assembled Printed Circuit Boards]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Semi_Auto_Strapping_Machine_PCBA--11194245_11194246.html]]></link><description><![CDATA[Processed： 0402, 0603, 0805, 1206, 1608, 2125, 3216 Micro QFP 0.2mm Flip-chip, BGA, Connectors BGA Ball Pitch=0.2mm 9, Each workstation in accordance with the SOP 10, Materials：FR-4, FPC, Aluminu]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Pcba Service for Elevator/Lift Controller PCB Assembly Board Custom Made Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Pcba_Service_for_Elevator_Lift--11408756_11409542.html]]></link><description><![CDATA[process.. All documents from customers are never shared with any third parties.
Q4. MOQ?
A: There is no MOQ in STHL.We are able to handle Small as well as large volume production with flexibility.
Q5]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[process such as drilling and metallization in the hole to connect the inside of each layer. HDI boards are generally manufactured by a laminated method. The more times the layers are stacked, the hig]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Original Electronics Component Logic IC Chips SOT23-5 SN74LVC1G125DBVR]]></title><link><![CDATA[https://hknovatech.en.ec21.com/Original_Electronics_Component_Logic_IC--11889683_11890223.html]]></link><description><![CDATA[Video Description:10
00:45
Original electronics component Logic ic chips SOT23-5 SN74LVC1G125DBVRModel NumberSN74LVC1G125DBVRBrief Description100% New and originalManufactureoriginalDate codenewPacka]]></description><pubDate><![CDATA[20240118]]></pubDate></item>
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<title><![CDATA[LED Substrate,Ceramic PCB, Ceramic Substrate, Thick Film Ceramic,Thin Film Ceramic,Ceramic Metallize]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/LED_Substrate_Ceramic_PCB_Ceramic--11797353_11797399.html]]></link><description><![CDATA[chip substrate: 
The integration of the thin film,thick film,electrode plating and electroless plating processes: Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communication]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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