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<title><![CDATA[EC21 Product Catalogs - Structural Component]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/Structural_Component--10120399/1/Structural Component.html]]></link><item>
<title><![CDATA[Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Aluminum_Silicon_Carbide_AlSiC_High--12057378_12057512.html]]></link><description><![CDATA[structural support and vibration resistance ensure the stability of components in harsh environments.
-High strength and rigidity make it less prone to warping and deformation due to external stress ]]></description><pubDate><![CDATA[20260709]]></pubDate></item>
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<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[component mounting stability
Flex Area
• Polyimide (PI, Kapton)
• Adhesiveless construction recommended (excellent heat resistance and durability)
Selection Criteria 
• Repeated bending and hig]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Hdi PCB]]></title><link><![CDATA[https://pcbmain68.en.ec21.com/Hdi_PCB--11046819_11046834.html]]></link><description><![CDATA[structures is available for components. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers.
Usually FPGA or BGA are available with 1mm or less spa]]></description><pubDate><![CDATA[20240606]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[structure can be used for components.
5. Reducing overall space requirements will result in smaller board sizes and fewer layers.
Electronic products continue to develop toward high density and high ]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[PCB Design Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/PCB_Design_Capabilities--11805203_11836258.html]]></link><description><![CDATA[structural engineers, also experts of design through PADs, PowerPCB, OrCAD, and more, GT has designed many types of boards range from the consumer electronics, industrial, medical, and telecommunicat]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[PCB Surface]]></title><link><![CDATA[https://greenstone23.en.ec21.com/PCB_Surface--11778431_11778453.html]]></link><description><![CDATA[PCB surface finish
include: PCB surface finish is a coating between a component and a bare board PCB. It is applied for two basic reasons: to ensure solderability, and to protect exposed copper circu]]></description><pubDate><![CDATA[20230428]]></pubDate></item>

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