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<title><![CDATA[EC21 Product Catalogs - bga chip]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/bga_chip--10120399/1/bga chip.html]]></link><item>
<title><![CDATA[Printed Circuit Board Assembly(PCBA)]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/Printed_Circuit_Board_Assembly_PCBA--12069958_12069959.html]]></link><description><![CDATA[chip components, ICs, BGAs, and QFNs.
• Solder paste printing → component mounting → reflow soldering.
DIP(Through-Hole) Assembly
• Insertion of insertable components such as connectors, tran]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
11, M]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Home Use Diesel Generator Printed Circuit Board Assemblies - Grande Electronics]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Home_Use_Diesel_Generator_Printed--4357166_4357168.html]]></link><description><![CDATA[chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, 
FR-1, 
94-V0 and so on.
11,]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[DS-908 Tin Planting Station for Soldering Tool Set]]></title><link><![CDATA[https://17169962783.en.ec21.com/DS_908_Tin_Planting_Station--11981731_11981735.html]]></link><description><![CDATA[Description:DS-908 Macbook BGA Reball Platform, includes 3 GPUs, 8 CPUs, 2 PCHs, 3 SMCs, a type-c control chip, a RAM with video memory stencil, 2 BGA chip stenci, a touch bar with fingerprint contro]]></description><pubDate><![CDATA[20240807]]></pubDate></item>
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<title><![CDATA[Embroidery Machine Prototype PCB Assembly Company | Grande Electronics]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Embroidery_Machine_Prototype_PCB_Assembly--11194245_11194265.html]]></link><description><![CDATA[chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
11, M]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
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<title><![CDATA[Banding Machine Pcba Housing Pcba Service Electronic Assembly Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Banding_Machine_Pcba_Housing_Pcba--11408756_11473657.html]]></link><description><![CDATA[BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement Bare Board Size Smallest:0.25*0.25 inches Largest:20*20 inc]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly
Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Industrial Control Equipment PCBA]]></title><link><![CDATA[https://hjl39506147520.en.ec21.com/Industrial_Control_Equipment_PCBA--11890882_11892786.html]]></link><description><![CDATA[PRODUCT DESCRIPTION
PCBA
Application
Industrial control equipment
CHIP Size
0402
QFN Spacing
0.4mm
QFN Spacing
0.4mm
BGA Ball Spacing
0.4mm
Package Type
Tape package, Tay tray package, Pipe package
]]></description><pubDate><![CDATA[20240124]]></pubDate></item>

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