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<title><![CDATA[EC21 Product Catalogs - blind via]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/blind_via--10120399/1/blind via.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[Via Specifications
• Through Via (PTH)
• Blind/Buried Via
• Micro Via (Laser Via)
Micro Via is used for high-density, miniaturized designs.
Stack-up design
• Separate signal, power, and groun]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[PCB Prototype Service]]></title><link><![CDATA[https://pcbmain68.en.ec21.com/PCB_Prototype_Service--11046819_11248715.html]]></link><description><![CDATA[Prototype PCB
For Prototype PCB
, our ablility is from 1 to 10Layers, we are able to manufacture low volume single and double-sided PCBs to complex multilayer PCBs with blind and buried vias at affor]]></description><pubDate><![CDATA[20240606]]></pubDate></item>
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<title><![CDATA[PCB Design Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/PCB_Design_Capabilities--11805203_11836258.html]]></link><description><![CDATA[via hole, blind/buried via and laser via technologies
• Flexible / flex-rigid printed circuits
• HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
• High spee]]></description><pubDate><![CDATA[20230821]]></pubDate></item>

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