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<title><![CDATA[EC21 Product Catalogs - chip carrier]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_carrier--10120399/1/chip carrier.html]]></link><item>
<title><![CDATA[Pcba Service for Elevator/Lift Controller PCB Assembly Board Custom Made Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Pcba_Service_for_Elevator_Lift--11408756_11409542.html]]></link><description><![CDATA[Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement Bare Board Size Smallest:0.25*0.25 inches Largest:20*20 inches File Formate Bill o]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Pcba Manufacturerone Stop Service Printed Circuit Board Assembly Prototype]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Pcba_Manufacturerone_Stop_Service_Printed--10919275_11050432.html]]></link><description><![CDATA[Chip Carrier/CSP Double-Sided SMT Assembly Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI Testing/In-circuit-test (ICT)/Flying Probe/Function ]]></description><pubDate><![CDATA[20231206]]></pubDate></item>

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