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<title><![CDATA[EC21 Product Catalogs - chip on board]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip_on_board--10120399/1/chip on board.html]]></link><item>
<title><![CDATA[Printed Circuit Board Assembly(PCBA)]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/Printed_Circuit_Board_Assembly_PCBA--12069958_12069959.html]]></link><description><![CDATA[Printed Circuit Board Assembly(PCBA)
Description
PCBA refers to the process of mounting and soldering electronic components on a printed circuit board (PCB) to create a functional circuit board. In o]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Economical Oil Mist Collector Printed Circuit Board (PCB) Assembly Manufacturing]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Economical_Oil_Mist_Collector_Printed--4357166_4357322.html]]></link><description><![CDATA[chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, 
FR-1, 94-V0 and so on.
11, ]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
11, M]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Non-Woven Fabric Manufacturing Machine Control Board PCBA Electronics]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Non_Woven_Fabric_Manufacturing_Machine--11194245_11194256.html]]></link><description><![CDATA[chip, BGA, ConnectorsBGA Ball Pitch=0.2mm9, Each workstation in accordance with the SOP 10, Materials: FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.11, Materi]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
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<title><![CDATA[Banding Machine Pcba Housing Pcba Service Electronic Assembly Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Banding_Machine_Pcba_Housing_Pcba--11408756_11473657.html]]></link><description><![CDATA[Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement Bare Board Size Smallest:0.25*0.25 inches Largest:20*20 inches File Formate Bill o]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line o]]></description><pubDate><![CDATA[20230821]]></pubDate></item>

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