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<title><![CDATA[EC21 Product Catalogs - drill hole]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/drill_hole--10120399/1/drill hole.html]]></link><item>
<title><![CDATA[PCB - Flex]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Flex--12069932_12069955.html]]></link><description><![CDATA[Holes
• PTH / Laser Via
• Drill size limitations exist due to the thin-film structure.
High-density implementation possible with laser vias. 
Surface Finish
• ENIG: Excellent flatness, solderab]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Bespoke Motherboard Solutions From China OEM/ODM Electronics Mother Board Drone Equipment Circuit Bo]]></title><link><![CDATA[https://sncpcb.en.ec21.com/Bespoke_Motherboard_Solutions_From_China--11979593_11981106.html]]></link><description><![CDATA[drilled hole size 0.25mmMin.line width 0.10mm(4mil)Min.line spaceing 0.10mm(4mil)Surface finish/treatment HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold ]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[OEM PCBA Manufacturer Customize]]></title><link><![CDATA[https://idsystemkr.en.ec21.com/OEM_PCBA_Manufacturer_Customize--11944840_11944841.html]]></link><description><![CDATA[PCB/PCBA &amp; SMT
(1) Consumer Electronic Device
(2) 2/4/6/8 layers or higher
(3) Special Production Process: Hole by Etching, Button Plate, Laser Drill, Build-up
(4) High Quality Control System, Quick ]]></description><pubDate><![CDATA[20240530]]></pubDate></item>
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<title><![CDATA[Single Cu-base PCB]]></title><link><![CDATA[https://pcbpcbaseller.en.ec21.com/Single_Cu_base_PCB--10961296_11944082.html]]></link><description><![CDATA[drill hole diameter PCB (PTH): ≥ 0,2 mm
●Minimum drill hole diameter PCB (NPTH): ≥ 1,0 mm
●Minimum drill hole diameter for aluminium: ≥ 1,0mm
●Drill hole/drill hole spacing: &gt; 1,2 mm
●M]]></description><pubDate><![CDATA[20240528]]></pubDate></item>
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<title><![CDATA[FR4 Base LED PCB Circuit Board 1oz Copper 3/3MIL Min Line]]></title><link><![CDATA[https://electronicpcbboard.en.ec21.com/FR4_Base_LED_PCB_Circuit--11895685_11895686.html]]></link><description><![CDATA[drilling)Board thickness≤1.2mm0.15mm0.2mmBoard thickness≤2.5mm0.2mm0.3mmBoard thickness＞2.5mmAspect Ration≤13:1Aspect Ration≤13:1Aspect RationAspect Ration≤13:1Aspect Ration≤13:1Board t]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[Printed Circuit Board]]></title><link><![CDATA[https://greenstone23.en.ec21.com/Printed_Circuit_Board--11778431_11889762.html]]></link><description><![CDATA[hole soldering technology solder the components onto the board. The components are soldered to the board can be SMD, through hole, UBGA, QFN, POP, leadless chips, connectors and terminals. 
PCB Manuf]]></description><pubDate><![CDATA[20240117]]></pubDate></item>
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<title><![CDATA[PCBA Layout]]></title><link><![CDATA[https://pennydlo2015.en.ec21.com/PCBA_Layout--11303710_11303796.html]]></link><description><![CDATA[FR4 Halogen Free, FR-1, FR-2, Aluminum 2. Board thickness:0.2mm-7mm 3. Max.finished board side:500mm*500mm 4. Min.drilled hole:0.25mm 5. Min.line width:0.075mm(3mil) 6. Copper thickness:0.5-4.0oz
]]></description><pubDate><![CDATA[20201203]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[drilling and metallization in the hole to connect the inside of each layer. HDI boards are generally manufactured by a laminated method. The more times the layers are stacked, the higher technical gr]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Smart Electronics PCBA Prototype PCB Assembly Manufacturing Customized Printed Circuit Board]]></title><link><![CDATA[https://ruomeipcb02.en.ec21.com/Smart_Electronics_PCBA_Prototype_PCB--11819316_11819378.html]]></link><description><![CDATA[width/gap 3.5/4mil(laser drill)Min. hole size 0.15mm(mechanical drill)/4mil(laser drill)Min. Annlar Ring 4milMax Copper thickness 6OZMin Solder Mask Bridge 0.08mmPlugging Vias capability 0.2-0.8mm]]></description><pubDate><![CDATA[20230713]]></pubDate></item>
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<title><![CDATA[Golden Triangle HDI PCB Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/Golden_Triangle_HDI_PCB_Capabilities--11805203_11836262.html]]></link><description><![CDATA[drilling process is then used to create the vias, which are tiny holes that help to connect the layers of the board. Finally, the solder mask is added to protect the board from oxidation and to make ]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Half Hole &amp; Through Hole PCB]]></title><link><![CDATA[https://hhcircuits.en.ec21.com/Half_Hole_Through_Hole_PCB--11798970_11798971.html]]></link><description><![CDATA[drilling (drilling, gong groove-plate surface plating-external Optical imaging-pattern plating-co-drying-half-hole processing-film stripping, etching, tin stripping-other processes-shape
Main Points ]]></description><pubDate><![CDATA[20230530]]></pubDate></item>

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