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<title><![CDATA[EC21 Product Catalogs - drilling hole]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/drilling_hole--10120399/1/drilling hole.html]]></link><item>
<title><![CDATA[PCB - Flex]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Flex--12069932_12069955.html]]></link><description><![CDATA[Holes
• PTH / Laser Via
• Drill size limitations exist due to the thin-film structure.
High-density implementation possible with laser vias. 
Surface Finish
• ENIG: Excellent flatness, solderab]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Bespoke Motherboard Solutions From China OEM/ODM Electronics Mother Board Drone Equipment Circuit Bo]]></title><link><![CDATA[https://sncpcb.en.ec21.com/Bespoke_Motherboard_Solutions_From_China--11979593_11981106.html]]></link><description><![CDATA[drilled hole size 0.25mmMin.line width 0.10mm(4mil)Min.line spaceing 0.10mm(4mil)Surface finish/treatment HASL/HASL lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold ]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[OEM PCBA Manufacturer Customize]]></title><link><![CDATA[https://idsystemkr.en.ec21.com/OEM_PCBA_Manufacturer_Customize--11944840_11944841.html]]></link><description><![CDATA[PCB/PCBA &amp; SMT
(1) Consumer Electronic Device
(2) 2/4/6/8 layers or higher
(3) Special Production Process: Hole by Etching, Button Plate, Laser Drill, Build-up
(4) High Quality Control System, Quick ]]></description><pubDate><![CDATA[20240530]]></pubDate></item>
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<title><![CDATA[Single Cu-base PCB]]></title><link><![CDATA[https://pcbpcbaseller.en.ec21.com/Single_Cu_base_PCB--10961296_11944082.html]]></link><description><![CDATA[drill hole diameter PCB (PTH): ≥ 0,2 mm
●Minimum drill hole diameter PCB (NPTH): ≥ 1,0 mm
●Minimum drill hole diameter for aluminium: ≥ 1,0mm
●Drill hole/drill hole spacing: &gt; 1,2 mm
●M]]></description><pubDate><![CDATA[20240528]]></pubDate></item>
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<title><![CDATA[FR4 Base LED PCB Circuit Board 1oz Copper 3/3MIL Min Line]]></title><link><![CDATA[https://electronicpcbboard.en.ec21.com/FR4_Base_LED_PCB_Circuit--11895685_11895686.html]]></link><description><![CDATA[drilling)Board thickness≤1.2mm0.15mm0.2mmBoard thickness≤2.5mm0.2mm0.3mmBoard thickness＞2.5mmAspect Ration≤13:1Aspect Ration≤13:1Aspect RationAspect Ration≤13:1Aspect Ration≤13:1Board t]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[PCB Manufacturer PCB Assembly Service Customized Printed Circuit Board in China]]></title><link><![CDATA[https://ruomeipcb02.en.ec21.com/PCB_Manufacturer_PCB_Assembly_Service--11819316_11819317.html]]></link><description><![CDATA[width/gap 3.5/4mil(laser drill)Min. hole size 0.15mm(mechanical drill)/4mil(laser drill)Min. Annlar Ring 4milMax Copper thickness 6OZMin Solder Mask Bridge 0.08mmPlugging Vias capability 0.2-0.8mm]]></description><pubDate><![CDATA[20230713]]></pubDate></item>
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<title><![CDATA[PCB Design Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/PCB_Design_Capabilities--11805203_11836258.html]]></link><description><![CDATA[hole, blind/buried via and laser via technologies
• Flexible / flex-rigid printed circuits
• HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
• High speed, m]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Printed Circuit Board]]></title><link><![CDATA[https://greenstone23.en.ec21.com/Printed_Circuit_Board--11778431_11889762.html]]></link><description><![CDATA[Drilling the PCB 
Electroless copper deposition
Image teh outer layer
Plating
Etch the outter layer
AOI
Solder mask
Surface finish
Profile
Electrical test
Finial inspection
Packing
We provide printed]]></description><pubDate><![CDATA[20240117]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[drilling and metallization in the hole to connect the inside of each layer. HDI boards are generally manufactured by a laminated method. The more times the layers are stacked, the higher technical gr]]></description><pubDate><![CDATA[20231206]]></pubDate></item>

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