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<title><![CDATA[EC21 Product Catalogs - flex ring]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/flex_ring--10120399/1/flex ring.html]]></link><item>
<title><![CDATA[Compressed Air Filter Circuit Board Manufacturing &amp; PCB Fabrication | Grande]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Compressed_Air_Filter_Circuit_Board--4357166_4357386.html]]></link><description><![CDATA[Supplier: Grande Electronics
Application: Compressed Air Filter Circuit Board Manufacturing &amp; PCB Fabrication | Grande
Layers: 4
PCB Parameter: FR-4/HTG150
Thickness: 1.0mm
Surface Treatment: ENIG
Te]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[Ring
4mil, 3mil - laser drill
Min Drilling Hole Diameter
6mil, 4mil - laser drill
Other Techniques
Flex-rigid combination 
Via In Pad 
Buried Capacitor (only for Prototype PCB total area ≤1m²)
Mor]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
<item>
<title><![CDATA[PCB Design Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/PCB_Design_Capabilities--11805203_11836258.html]]></link><description><![CDATA[Flexible / flex-rigid printed circuits
• HDI Designs with micro vias and advanced materials – Via-in-Pad, laser micro vias.
• High speed, multi-layer digital printed circuit design and fabricat]]></description><pubDate><![CDATA[20230821]]></pubDate></item>

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