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<title><![CDATA[EC21 Product Catalogs - flip flips]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/flip_flips--10120399/1/flip flips.html]]></link><item>
<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Automotive PCB Assembly | PCBA for Vehicle Electrical System | Grande]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Automotive_PCB_Assembly_PCBA_for--4357166_4357474.html]]></link><description><![CDATA[Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Rice_Milling_Machine_PCB_Assembly--11194245_11194269.html]]></link><description><![CDATA[Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP 
10, Materials：FR-4, FPC, Aluminum，High TG，Halogen-Free, HF, CEM-1, CEM-3, FR-1, 94-V0 and so on.
]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[LED Substrate,Ceramic PCB, Ceramic Substrate, Thick Film Ceramic,Thin Film Ceramic,Ceramic Metallize]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/LED_Substrate_Ceramic_PCB_Ceramic--11797353_11797399.html]]></link><description><![CDATA[Flip chip substrate: 
The integration of the thin film,thick film,electrode plating and electroless plating processes: Application:
1. High Power LED ceramic substrate
2. Microwave (Wireless Communic]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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