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<title><![CDATA[EC21 Product Catalogs - functional packaging material]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/functional_packaging_material--10120399/1/functional packaging material.html]]></link><item>
<title><![CDATA[Air Compressors Board Electronics PCBA PCB Assembly -Contract Manufacturing]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Air_Compressors_Board_Electronics_PCBA--4357166_4361360.html]]></link><description><![CDATA[Functional Circuit Test and X-ray test.
8, Package Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accorda]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
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<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[Functional Circuit Test and X-ray test.
8, Package Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accorda]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Pressure Sensor Medical Electronic Care Device PCB Board Assembly]]></title><link><![CDATA[https://avpcb.en.ec21.com/Pressure_Sensor_Medical_Electronic_Care--12017667_12017668.html]]></link><description><![CDATA[Pressure Sensor Medical Electronic Care Device PCB Board Assembly
Industry-specific attributes
Base Material FR4/ALU/FPC
Board Thickness 0.4MM/0.6MM/0.8MM/1MM/1.6MM
Other attributes
Model Number
Plac]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[China OEM/ODM PCBA Experts in Customized Electronics Motherboards Assembly Inverter LED PCB SMT PCBA]]></title><link><![CDATA[https://sncpcb.en.ec21.com/China_OEM_ODM_PCBA_Experts--11979593_11981134.html]]></link><description><![CDATA[Functional Test (FCT)Custom clearance for material importing and product exporting Other PCBA Assembly Equipment SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4Reflow Oven: FolunGwin FL-R]]></description><pubDate><![CDATA[20240806]]></pubDate></item>
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<title><![CDATA[Multilayer Printed Circuit Board]]></title><link><![CDATA[https://bgpcba.en.ec21.com/Multilayer_Printed_Circuit_Board--11935225_11935227.html]]></link><description><![CDATA[material in between.
These layers are interconnected through vias, tiny conductive pathways that allow signals to travel between different layers. This intricate construction enables multilayer PCBs ]]></description><pubDate><![CDATA[20240512]]></pubDate></item>
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<title><![CDATA[Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Rice_Milling_Machine_PCB_Assembly--11194245_11194269.html]]></link><description><![CDATA[Functional Circuit Test and X-ray test.
8, Package Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accorda]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[Banding Machine Pcba Housing Pcba Service Electronic Assembly Shenzhen PCBA Factory]]></title><link><![CDATA[https://440183199803063144.en.ec21.com/Banding_Machine_Pcba_Housing_Pcba--11408756_11473657.html]]></link><description><![CDATA[Materials Gerber files Pick-N-Place file Types of Service Turn-key,partial turn-key or consignment Component packaging Cut Tape,Tube,Reels,Loose Parts Turn Time Same day service to 15 days service Te]]></description><pubDate><![CDATA[20220530]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[packaging density. The space obtained by the finer track structure can be used for components.
5. Reducing overall space requirements will result in smaller board sizes and fewer layers.
Electronic p]]></description><pubDate><![CDATA[20231206]]></pubDate></item>

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