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<title><![CDATA[EC21 Product Catalogs - ground blind]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/ground_blind--10120399/1/ground blind.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[Blind/Buried Via
• Micro Via (Laser Via)
Micro Via is used for high-density, miniaturized designs.
Stack-up design
• Separate signal, power, and ground layers
• Symmetrical structure minimizes ]]></description><pubDate><![CDATA[20260411]]></pubDate></item>

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