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<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - heat transfer flex]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/heat_transfer_flex--10120399/1/heat transfer flex.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[Flex Area
• Polyimide (PI, Kapton)
• Adhesiveless construction recommended (excellent heat resistance and durability)
Selection Criteria 
• Repeated bending and high reliability → Adhesiveles]]></description><pubDate><![CDATA[20260411]]></pubDate></item>

</channel>
</rss>