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<title><![CDATA[EC21 Product Catalogs - integrated circuit]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/integrated_circuit--10120399/1/integrated circuit.html]]></link><item>
<title><![CDATA[Electronics Components Original Integrated Circuits IC Chip STM8S003K3T6C Microcontrollers]]></title><link><![CDATA[https://avpcb.en.ec21.com/Electronics_Components_Original_Integrated_Circuits--12017667_12017676.html]]></link><description><![CDATA[electronics components original integrated circuits ic chip STM8S003K3T6C microcontrollers manufacturing supplier CISC microchip
Place of Origin Guangdong, China
Brand Name: Original
Model Number STM]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[PCB - Multi-Layer]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Multi_Layer--12069932_12069954.html]]></link><description><![CDATA[PCB - Multi-Layer
Description
A multilayer printed circuit board (PCB) is a PCB made by laminating three or more layers (typically four, six, or eight or more) of copper foil with an insulating layer]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Nanomaterial Synthesis Equipment Circuit Board PCB Assembly]]></title><link><![CDATA[https://tecoopcba.en.ec21.com/Nanomaterial_Synthesis_Equipment_Circuit_Board--12055074_12055025.html]]></link><description><![CDATA[Integration: The PCBA integrates various electronic components, likely including microcontrollers, sensors, power management circuits, communication interfaces, and motor drivers, onto a printed circ]]></description><pubDate><![CDATA[20260429]]></pubDate></item>
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<title><![CDATA[220V Bulb Light, Downlights, GU10 Cup, MR16, Par Light, Chandelier Lamps DOB Module, PCBA, LED PCB]]></title><link><![CDATA[https://smarled.en.ec21.com/220V_Bulb_Light_Downlights_GU10--12069594_12069604.html]]></link><description><![CDATA[Integrated circuit, compact size, flexible and innovative design.
3) Over temperature protection, over voltage protection, surge protection.
4) Low THD. Easier to pass EMC test and other certificate ]]></description><pubDate><![CDATA[20260419]]></pubDate></item>
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<title><![CDATA[Rogers RO3003 Ceramics with High Frequency PCB]]></title><link><![CDATA[https://anyatsai.en.ec21.com/Rogers_RO3003_Ceramics_with_High--12024589_12024590.html]]></link><description><![CDATA[circuits, microwave communication devices, 5G base stations, aerospace electronics, and automotive radar systems, where stringent signal integrity is paramount. For applications demanding high signal]]></description><pubDate><![CDATA[20241115]]></pubDate></item>
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<title><![CDATA[Aluminum PCB]]></title><link><![CDATA[https://pcbmain68.en.ec21.com/Aluminum_PCB--11046819_11046826.html]]></link><description><![CDATA[Aluminum PCB
Advanced Circuits Specification
Aluminum Printed Circuit Boards 
Contain a Thin Layer of Thermally Conductive Dielectric Material that Transfers Heat.
There are many names for these prod]]></description><pubDate><![CDATA[20240606]]></pubDate></item>
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<title><![CDATA[Best Rogers PCB]]></title><link><![CDATA[https://bgpcba.en.ec21.com/Best_Rogers_PCB--11935225_11935232.html]]></link><description><![CDATA[BEST ROGERS PCB
Description:
The &quot;best&quot; Rogers PCB (printed circuit board) would depend on the specific requirements of your project. Rogers Corporation is renowned for its high-performance PCB mater]]></description><pubDate><![CDATA[20240512]]></pubDate></item>
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<title><![CDATA[Electronic Printed Circuit Board Assembly with Board Thickness 0.2mm-6.0mm]]></title><link><![CDATA[https://pcbaboardassembly.en.ec21.com/Electronic_Printed_Circuit_Board_Assembly--11894893_11894894.html]]></link><description><![CDATA[integrated circuits, and other electronic components.Q:What type of surface finish is used for PCBA Board Assembly?A:The most common surface finish used for PCBA Board Assembly is HASL (Hot Air Solde]]></description><pubDate><![CDATA[20240129]]></pubDate></item>
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<title><![CDATA[FET for PCB]]></title><link><![CDATA[https://ronghuaindustry.en.ec21.com/FET_for_PCB--11791188_11816390.html]]></link><description><![CDATA[circuits, such as those found in wireless communication systems and radar.
Ease of Integration: FETs are easy to integrate into PCB designs, as they are available in a wide range of packages, includi]]></description><pubDate><![CDATA[20230706]]></pubDate></item>
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<title><![CDATA[BGA PCB Assembly]]></title><link><![CDATA[https://greenstone23.en.ec21.com/BGA_PCB_Assembly--11778431_11836176.html]]></link><description><![CDATA[A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provi]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[High Precision Smt 12 Layers Pcba]]></title><link><![CDATA[https://cttpcb.en.ec21.com/High_Precision_Smt_12_Layers--10919275_11050456.html]]></link><description><![CDATA[integrated-info.com
http://www.freeequipmentlist.com
http://www.unlimitedbusinesslist.com
http://www.listitsocial.com
http://www.goodelectronicblog.com
http://www.agricultureillustrations.com
]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
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<title><![CDATA[Aluminium Copper Clad Laminate]]></title><link><![CDATA[https://zws922.en.ec21.com/Aluminium_Copper_Clad_Laminate--2351197_3988975.html]]></link><description><![CDATA[circuit
çµæºçµè·¯ Power supply
æ··åéæçµè·¯ Hybrid integrated circuits
åºæç»§çµå¨ Solid State Relays
ç­éè¦é«æ£ç­ç]]></description><pubDate><![CDATA[20110304]]></pubDate></item>
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<title><![CDATA[Hdi PCB]]></title><link><![CDATA[https://gtpcba.en.ec21.com/Hdi_PCB--11805203_11836260.html]]></link><description><![CDATA[circuit density. By utilizing high-density interconnects (HDI) between layers, they are able to achieve extremely high levels of integration that would otherwise be difficult or impossible to achieve]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Heavy Copper PCB]]></title><link><![CDATA[https://hhcircuits.en.ec21.com/Heavy_Copper_PCB--11798970_11798978.html]]></link><description><![CDATA[integrity of the plating layer in the hole.
2. When the circuit board is electroplated for 5 minutes, take out the substrate and observe whether the copper layer on the surface and the inner wall of ]]></description><pubDate><![CDATA[20230530]]></pubDate></item>
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<title><![CDATA[Ceramic Substrate,Ceramic PCB,Ceramic Metallization,AlN,Al2O3,Direct Plating Copper,DPC,DBC,Ceramic]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/Ceramic_Substrate_Ceramic_PCB_Ceramic--11797353_11797373.html]]></link><description><![CDATA[Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers &amp; produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate met]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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