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<title><![CDATA[EC21 Product Catalogs - micro component inspection]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/micro_component_inspection--10120399/1/micro component inspection.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[component mounting stability
Flex Area
• Polyimide (PI, Kapton)
• Adhesiveless construction recommended (excellent heat resistance and durability)
Selection Criteria 
• Repeated bending and hig]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[Components Down to 0201 Size BGA and VFBGA Leadless Chip Carrier/CSP Double-Sided SMT Assembly
Fine Pitch to 08 Mil BGA Repair and ReballPart Removal and Replacement
SMT and DIP/X-RAY Inspection/AOI ]]></description><pubDate><![CDATA[20231206]]></pubDate></item>

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