<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - micro electronic packages]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/micro_electronic_packages--10120399/1/micro electronic packages.html]]></link><item>
<title><![CDATA[Combined Hydraulic Busbar Processing Machine PCBA Manufacturer | Grande]]></title><link><![CDATA[https://yygreattong.en.ec21.com/Combined_Hydraulic_Busbar_Processing_Machine--4357166_4357298.html]]></link><description><![CDATA[Supplier:Grande Electronics
Layers: 4
PCB：FR-4/1.6mm, 1oz finished copper
Application: Combined Hydraulic Busbar Processing Machine PCBA Manufacturer | Grande
Surface Treatment: HASL
PCBA Lead time]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Material Handling Equipment Circuit Board Industrial PCBA Electronics]]></title><link><![CDATA[https://pcbdesign12.en.ec21.com/Material_Handling_Equipment_Circuit_Board--10035716_10038624.html]]></link><description><![CDATA[Supplier: Grande Electronics
Project: Material Handling Equipment Circuit Board Industrial PCBA Electronics
Layers: 4
PCB：FR-4/1.6mm, 1oz finished copper
Surface Treatment: ENIG
PCBA Lead time:3-4 ]]></description><pubDate><![CDATA[20250401]]></pubDate></item>
<item>
<title><![CDATA[Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly]]></title><link><![CDATA[https://grandepcba.en.ec21.com/Rice_Milling_Machine_PCB_Assembly--11194245_11194269.html]]></link><description><![CDATA[Supplier: Shenzhen Grande Electronics
Layers: 4
PCB：FR-4/1.6mm, 1oz finished copper
Application: Rice Milling Machine PCB Assembly Services | Printed Circuit Board Assembly
Surface Treatment: HASL
]]></description><pubDate><![CDATA[20240506]]></pubDate></item>
<item>
<title><![CDATA[Fast Supply Electric Circuit Board Assembly Manufacturer]]></title><link><![CDATA[https://cttpcb.en.ec21.com/Fast_Supply_Electric_Circuit_Board--10919275_11050449.html]]></link><description><![CDATA[packaging density. The space obtained by the finer track structure can be used for components.
5. Reducing overall space requirements will result in smaller board sizes and fewer layers.
Electronic p]]></description><pubDate><![CDATA[20231206]]></pubDate></item>
<item>
<title><![CDATA[IC Assembly Services for Fabless Companies]]></title><link><![CDATA[https://standardsk.en.ec21.com/IC_Assembly_Services_for_Fabless--6209763_6227356.html]]></link><description><![CDATA[Packages as followings are;
QFP, LQFP, TQFP, QFN, BAG Types, CSP, SO, SOT, TSOP, TSSOP, PLCC, DIP, PDIP..., ETC.
We can support customer`s budget and size objecives regarding small quantity with Prot]]></description><pubDate><![CDATA[20170517]]></pubDate></item>

</channel>
</rss>