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<title><![CDATA[EC21 Product Catalogs - selective masking]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/selective_masking--10120399/1/selective masking.html]]></link><item>
<title><![CDATA[PCB - Hdi]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/PCB_Hdi--12069932_12069957.html]]></link><description><![CDATA[Selection Criteria 
• Simple Folding/Connection → Flex 1-2 Layers
• High-Speed/High-Density → Flex Multi-Layer + Rigid Multi-Layer
Base Material
Rigid Area
• FR-4 / High-Tg FR-4
• Provide]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[PCB Surface]]></title><link><![CDATA[https://greenstone23.en.ec21.com/PCB_Surface--11778431_11778453.html]]></link><description><![CDATA[selecting the right one is no easy task, especially as surface mounts have become more complex and regulations such as RoHS and WEEE have changed industry standards.
Recently, the common surface pcb ]]></description><pubDate><![CDATA[20230428]]></pubDate></item>
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<title><![CDATA[Golden Triangle HDI PCB Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/Golden_Triangle_HDI_PCB_Capabilities--11805203_11836262.html]]></link><description><![CDATA[selectively remove copper from the board to create the desired pattern. Chemical etching is then used to create fine routing lines between the components. The mechanical drilling process is then used]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Heavy Copper PCB]]></title><link><![CDATA[https://hhcircuits.en.ec21.com/Heavy_Copper_PCB--11798970_11798978.html]]></link><description><![CDATA[select the milling process parameters.
3. When fixing the position of the circuit board, carefully clamp it so as not to damage the solder layer and solder mask on the surface of the circuit board.
4]]></description><pubDate><![CDATA[20230530]]></pubDate></item>

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