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<title><![CDATA[EC21 Product Catalogs - selective soldering]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/selective_soldering--10120399/1/selective soldering.html]]></link><item>
<title><![CDATA[Printed Circuit Board Assembly(PCBA)]]></title><link><![CDATA[https://ckmo1018.en.ec21.com/Printed_Circuit_Board_Assembly_PCBA--12069958_12069959.html]]></link><description><![CDATA[soldering.
DIP(Through-Hole) Assembly
• Insertion of insertable components such as connectors, transformers, and large capacitors.
• Wave soldering or manual/selective soldering.
Mixed process(SM]]></description><pubDate><![CDATA[20260411]]></pubDate></item>
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<title><![CDATA[LED Aluminium PCBA]]></title><link><![CDATA[https://avpcb.en.ec21.com/LED_Aluminium_PCBA--12017667_12017675.html]]></link><description><![CDATA[soldering to create secure connections.
4. Rigorous Quality Control
Quality is our top priority. Throughout the LED PCB assembly process, we implement strict quality control measures, including:
Visu]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[PCB Surface Finish]]></title><link><![CDATA[https://bgpcba.en.ec21.com/PCB_Surface_Finish--11935225_11935292.html]]></link><description><![CDATA[solder joints. OSP, on the other hand, is cost-effective and environmentally friendly, ideal for applications where lead-free soldering is required.
Choosing the right surface finish is essential for]]></description><pubDate><![CDATA[20240512]]></pubDate></item>
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<title><![CDATA[PCB Surface]]></title><link><![CDATA[https://greenstone23.en.ec21.com/PCB_Surface--11778431_11778453.html]]></link><description><![CDATA[solder mask layer on the PCB board
Preventing short circuit from bridge connection in the soldering process
Preventing the physical breakage of a conductor circuit
Prevent short circuit between condu]]></description><pubDate><![CDATA[20230428]]></pubDate></item>
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<title><![CDATA[Golden Triangle HDI PCB Capabilities]]></title><link><![CDATA[https://gtpcba.en.ec21.com/Golden_Triangle_HDI_PCB_Capabilities--11805203_11836262.html]]></link><description><![CDATA[selectively remove copper from the board to create the desired pattern. Chemical etching is then used to create fine routing lines between the components. The mechanical drilling process is then used]]></description><pubDate><![CDATA[20230821]]></pubDate></item>
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<title><![CDATA[Heavy Copper PCB]]></title><link><![CDATA[https://hhcircuits.en.ec21.com/Heavy_Copper_PCB--11798970_11798978.html]]></link><description><![CDATA[select the milling process parameters.
3. When fixing the position of the circuit board, carefully clamp it so as not to damage the solder layer and solder mask on the surface of the circuit board.
4]]></description><pubDate><![CDATA[20230530]]></pubDate></item>

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