EC21 Product Catalogs - semiconductor substrate

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

20260703

Substrate Specification Silicon Carbide volume fraction 65 % Density （g/cm³） 3.01 Elastic Modulus （GPa） 215±5 Bending Strength （MPa） 380 Tensile Strength （MPa） 270 Coefficient of Th

OEM Wafer Cleaning Machine PCBA Manufacturer

20260429

semiconductor wafer cleaning equipment. It integrates high-precision temperature control (±0.1℃), dynamic flow monitoring (response time <10ms) and anti-corrosion design (ceramic substrate + gold

LED Substrate,Ceramic PCB, Ceramic Substrate, Thick Film Ceramic,Thin Film Ceramic,Ceramic Metallize

20240117

substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate For m