EC21 Product Catalogs - wafer plating

OEM Wafer Cleaning Machine PCBA Manufacturer

20260429

wafer cleaning equipment. It integrates high-precision temperature control (±0.1℃), dynamic flow monitoring (response time <10ms) and anti-corrosion design (ceramic substrate + gold plating proces

FR4 Base LED PCB Circuit Board 1oz Copper 3/3MIL Min Line

20240131

wafer inspection systems, etc. Capability 　High precision prototypePCB bulk productionMax Layers1-28 layers1-14 layersMIN Line width(mil)3mil4milMIN Line space(mil)3mil4milMin via (mechanical drill

LED Substrate,Ceramic PCB, Ceramic Substrate, Thick Film Ceramic,Thin Film Ceramic,Ceramic Metallize

20240117

plating: 1um~150um Ceramic Metallized substrate : Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED COB ceramic substrate LED Al