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<title><![CDATA[EC21 Product Catalogs - backgrinding]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/backgrinding--050108/1/backgrinding.html]]></link><item>
<title><![CDATA[Semiconductor / Double Side Tape]]></title><link><![CDATA[https://daehyunsthq.en.ec21.com/Semiconductor_Double_Side_Tape--11495972_11496008.html]]></link><description><![CDATA[t is excellent for surface protection of substrates such as wafers in semiconductor, backgrinding and dicing processes.
Daehyunst is providing special, high-performance tapes according to the diversi]]></description><pubDate><![CDATA[20211221]]></pubDate></item>

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