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<title><![CDATA[EC21 Product Catalogs - surface led packaging tapes]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/surface_led_packaging_tapes--050108/1/surface led packaging tapes.html]]></link><item>
<title><![CDATA[Semiconductor / Double Side Tape]]></title><link><![CDATA[https://daehyunsthq.en.ec21.com/Semiconductor_Double_Side_Tape--11495972_11496008.html]]></link><description><![CDATA[tapes that can be applied to backgrinding, wafer dicing, epoxy molding, and packaging dicing during the post-processing of LED chips and semiconductors.
UV TapeDicing &amp; GrindingPrevent chip flying du]]></description><pubDate><![CDATA[20211221]]></pubDate></item>

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