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<title><![CDATA[EC21 Product Catalogs - low molecular weight grade]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/low_molecular_weight_grade--0549/1/low molecular weight grade.html]]></link><item>
<title><![CDATA[High Quality DOTP Plasticizer Additives Dioctyl Terephthalate DOTP CAS NO.: 6422-86-2]]></title><link><![CDATA[https://yuanyide.en.ec21.com/High_Quality_DOTP_Plasticizer_Additives--12018731_12019418.html]]></link><description><![CDATA[DIOCTYL TEREPHTHALATE[DOTP] 
Commodity Name: Plasticizing Agent DOTP 
Molecular Formula:C24H38O4 
Molecular Weight: 390.52g/mol 
DOTP is a new environment-friendly plasticizer. With low price and exc]]></description><pubDate><![CDATA[20241021]]></pubDate></item>
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<title><![CDATA[Dioctyl Terephthalate (DOTP)]]></title><link><![CDATA[https://wendy98320.en.ec21.com/Dioctyl_Terephthalate_DOTP--11839196_11839347.html]]></link><description><![CDATA[Chemical Name: Di-2-ethylhexyl terephthalateCAS NO.:6422-86-2 Molecular Formula: C24H38O4 Molecular Weight: 390.50 g/mole Melting Point: -50 ℃Boiling Point: 380℃ Appearance: Transparent liquid Pr]]></description><pubDate><![CDATA[20230829]]></pubDate></item>
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<title><![CDATA[Methyl Octabromoether RX-972 CAS 97416-84-7 Replace HBCD Flame Retardant XPS EPS]]></title><link><![CDATA[https://sdrixing.en.ec21.com/Methyl_Octabromoether_RX_972_CAS--11678681_11701943.html]]></link><description><![CDATA[Molecular FormulaC23H24O2Br8Molecular Weight971.66AppearanceWhite or off white powder/granuleBromine Content≥65%Melting Point≥110ºCVolatile Matter≤0.3%PH6.5-8.5Boiling Point685.3°C at 760mmHg]]></description><pubDate><![CDATA[20230103]]></pubDate></item>
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<title><![CDATA[Silicone Masterbatch LYSI-401 Improve Processability and Productivity in HFFR Wire and Cable]]></title><link><![CDATA[https://silikefrankji1995.en.ec21.com/Silicone_Masterbatch_LYSI_401_Improve--11592293_11593993.html]]></link><description><![CDATA[molecular weight siloxane polymer dispersed in low density polyethylene (LDPE ). It is widely used as an efficient processing additive in PE compatible resin system to improve the processing properti]]></description><pubDate><![CDATA[20220628]]></pubDate></item>

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