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<title><![CDATA[EC21 Product Catalogs - semiconductor back grinding]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_back_grinding--3045/1/semiconductor back grinding.html]]></link><item>
<title><![CDATA[Protection Tape (PI &amp; PET Film Base)]]></title><link><![CDATA[https://lciglobal.en.ec21.com/Protection_Tape_PI_PET_Film--11858416_11858417.html]]></link><description><![CDATA[Semiconductor field : Wafer back-grinding
and dicing of semiconductor processes
- Specialty field : High humidity activated
film / Thermal Transfer Tape / Thermal Release Tape
- Battery field : Insul]]></description><pubDate><![CDATA[20240222]]></pubDate></item>

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