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<title><![CDATA[EC21 Product Catalogs - semiconductor back grinding]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor_back_grinding--330815/1/semiconductor back grinding.html]]></link><item>
<title><![CDATA[Thermoplastic Multilayer Film  Back Grinding Film]]></title><link><![CDATA[https://81368268181.en.ec21.com/Thermoplastic_Multilayer_Film_Back_Grinding--11991856_11997509.html]]></link><description><![CDATA[Thermoplastic Multilayer Film
Dicing film for semiconductor production.
Back Grinding Film. Die Attach Film.
Features
Contributes to improving semiconductor quality and yield by minimizing fish eyes.]]></description><pubDate><![CDATA[20241001]]></pubDate></item>

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