<?xml version="1.0" encoding="utf-8" ?>
<rss version="2.0">
<channel>
<title><![CDATA[EC21 Product Catalogs - dcda]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/dcda--0552/1/dcda.html]]></link><item>
<title><![CDATA[Dicyandiamide]]></title><link><![CDATA[https://shengyow.en.ec21.com/Dicyandiamide--4264637_11909374.html]]></link><description><![CDATA[Electronic / nano grade Dicyandiamide, DCDA, DICY.Dicyandiamide is used as a slow release fertilizer. In the adhesive industry, Dicyandiamide is used as a curing agent for epoxies. Dicyandiamide is a]]></description><pubDate><![CDATA[20240307]]></pubDate></item>

</channel>
</rss>