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<title><![CDATA[EC21 Product Catalogs - chip scale package]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/chip scale package.html]]></link><item>
<title><![CDATA[Cylindrical Borosilicate Glass Alkali Vapor Cell for Quantum Sensing]]></title><link><![CDATA[https://meticulab.en.ec21.com/Cylindrical_Borosilicate_Glass_Alkali_Vapor--12069884_12071092.html]]></link><description><![CDATA[chip‑scale, CPT, passive)
Optically pumped magnetometers (geomagnetic, biomagnetic)
Nuclear magnetic resonance gyroscopes
Rydberg atom sensors (RF/THz field sensing)
Cold atom experiments and quant]]></description><pubDate><![CDATA[20260502]]></pubDate></item>
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<title><![CDATA[Electronics Components Original Integrated Circuits IC Chip STM8S003K3T6C Microcontrollers]]></title><link><![CDATA[https://avpcb.en.ec21.com/Electronics_Components_Original_Integrated_Circuits--12017667_12017676.html]]></link><description><![CDATA[chip
Place of Origin Guangdong, China
Brand Name: Original
Model Number STM8S003K3T6C
Package :tsop20
Brand :ST
Operating Temperature:Original
Payment ways :ALL
Electronic Components Diverse Product ]]></description><pubDate><![CDATA[20241015]]></pubDate></item>
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<title><![CDATA[P20 DIP LED Traffic Sign Ful Color Roadway Safety Variable Message Sign LED Display]]></title><link><![CDATA[https://glareled005.en.ec21.com/P20_DIP_LED_Traffic_Sign--11009082_11660922.html]]></link><description><![CDATA[package uses advanced soft silicone, the elastic, strong anti-aging ability. Power supply, it is important IC device through the heat sink cooling, not only solve the heat, but also to ensure the Per]]></description><pubDate><![CDATA[20240614]]></pubDate></item>
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<title><![CDATA[Piotec Smart Card Making Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/Piotec_Smart_Card_Making_Machine--11883003_11941753.html]]></link><description><![CDATA[chips. This process is known as dicing.
Packaging: The individual chips are then packaged to protect them from physical damage and environmental factors. This involves placing the chip in a protectiv]]></description><pubDate><![CDATA[20240524]]></pubDate></item>
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<title><![CDATA[15 W 9V/6V Lightweight Solar Panel]]></title><link><![CDATA[https://dfsolarkit.en.ec21.com/15_W_9V_6V_Lightweight--11933707_11933708.html]]></link><description><![CDATA[15 W 9V/6V Lightweight Solar Panel
1.DF-0915 15W Solar Panel can Charge Mobile /Power Bank /speaker /6V Battery /Scales /Fans and All 5V USB Devices
2.Pack With USB Cable (5 in 1)
3.Smart Chips X2
4.]]></description><pubDate><![CDATA[20240508]]></pubDate></item>
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<title><![CDATA[Toyota Hilux Vigo Pickup]]></title><link><![CDATA[https://thesource.en.ec21.com/Toyota_Hilux_Vigo_Pickup--569635_6493850.html]]></link><description><![CDATA[packaging have liberated more interior space front and rear and enabled designers to offer a more natural seating position.
Power Adjustable Leather Driver Seat
Toyota Hilux Revo Driver seat is adjus]]></description><pubDate><![CDATA[20160409]]></pubDate></item>
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<title><![CDATA[HQ1290 CO2 Laser Engraver/Cutter Engraving/Cutting Machine 1200*900MM]]></title><link><![CDATA[https://liuwinter.en.ec21.com/HQ1290_CO2_Laser_Engraver_Cutter--1839717_3371590.html]]></link><description><![CDATA[scale engraving and cutting, such as clothing&amp;leather, packaging&amp;plate making, handicraft, advertisement&amp;decoration, construction&amp;fittings, mould, toys, embroidery and cutting. Special Recommended:
&lt;]]></description><pubDate><![CDATA[20220301]]></pubDate></item>
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<title><![CDATA[1E1-16E1 To 10 / 100base-T Protocol Converter]]></title><link><![CDATA[https://dailianxu.en.ec21.com/1E1_16E1_To_10_100base--2131172_2131289.html]]></link><description><![CDATA[package via address list and be transparent in TCP/ IP protocol. 
Product Feature 
1. Adopts large-scale integrate chip, brief circuit, low power consumption and high reliability structure 
2. Offers]]></description><pubDate><![CDATA[20081120]]></pubDate></item>
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<title><![CDATA[Ceramic Substrate]]></title><link><![CDATA[https://blueskycs8.en.ec21.com/Ceramic_Substrate--5461106_7090952.html]]></link><description><![CDATA[scale integrated circuits, mixed IC, semiconductor packaging, chip resistors, network resistors, focus potentiometer, power module, power hybrid circuit and other related areas Advantage: has high re]]></description><pubDate><![CDATA[20120916]]></pubDate></item>
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<title><![CDATA[OEM SEMI Chip]]></title><link><![CDATA[https://walliam999.en.ec21.com/OEM_SEMI_Chip--6542750_6705733.html]]></link><description><![CDATA[4. ion implantation
5. Semiconductor chip package DualIn－line Package Plastic Quad Flat Package Plastic Flat Package Chip Scale Package Pin Grid Array Package Ball Grid Array Package 6. test
]]></description><pubDate><![CDATA[20120520]]></pubDate></item>
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<title><![CDATA[S3C ARM11 Development Board 7inch, TINY6410 ARM Kit]]></title><link><![CDATA[https://tymall.en.ec21.com/S3C_ARM11_Development_Board_7inch--4823045_7271204.html]]></link><description><![CDATA[packages will have different LCD types, others are all the same ( 1) with a precision of touch, light adjustable ( 2) with a fine material ABS panel, easy disassembly ( 3 ) to provide LCD driver boar]]></description><pubDate><![CDATA[20121107]]></pubDate></item>
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<title><![CDATA[OW-400 2N10 Extreme High Power WIFI6 Dual-radio +10dbi Outdoor Poe Bridge/Ap]]></title><link><![CDATA[https://cathykao0114.en.ec21.com/OW_400_2N10_Extreme_High--11815998_11816009.html]]></link><description><![CDATA[FCC, NCC, ROHS Compliant 
Package ContentOW-400 2N10 Main Unitx1PoE Power Supply Kitx1Adjustable Mounting Bracket Setx1Quick Installation Guide(Chinese/English)x2Warranty Cardx1
]]></description><pubDate><![CDATA[20230706]]></pubDate></item>
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<title><![CDATA[12V/ 24Vdc Micro Solar Circulation Pump Low Noise 800/800A-C]]></title><link><![CDATA[https://shyskytech.en.ec21.com/12V_24Vdc_Micro_Solar_Circulation--8464416_8465817.html]]></link><description><![CDATA[Package Included
1pcs x 800/800A-C-24V Micro Brushless DC Pump 
How to Choose pump: 1. Make sure the working voltage, current, head and flow. The Max head means the static head. The pump can lift to ]]></description><pubDate><![CDATA[20140905]]></pubDate></item>
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<title><![CDATA[Electronic Tensile Strength Test Equipment LDS-50A]]></title><link><![CDATA[https://astmtester123.en.ec21.com/Electronic_Tensile_Strength_Test_Equipment--9999781_10000242.html]]></link><description><![CDATA[Function and Usages
Using alternating current servo motor as a power source, this testing machine adopts the single chip displaying the test data and test condition real-timely, which through the sin]]></description><pubDate><![CDATA[20190815]]></pubDate></item>
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<title><![CDATA[LDS-50A 50kN Metal Material Universal Tensile Compression Bending and Shearing Testing Machine]]></title><link><![CDATA[https://lgtester789.en.ec21.com/LDS_50A_50kN_Metal_Material--10000302_10012238.html]]></link><description><![CDATA[Function and Usages
Using alternating current servo motor as a power source, this testing machine adopts the single
chip displaying the test data and test condition real-timely, which through the sin]]></description><pubDate><![CDATA[20190821]]></pubDate></item>
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<title><![CDATA[Biomass Wood Pellet Making Machine Line]]></title><link><![CDATA[https://feedmachine.en.ec21.com/Biomass_Wood_Pellet_Making_Machine--9196736_9205289.html]]></link><description><![CDATA[chips,grass,sawdust,hops ,pasture,soyabean straw and so on
5. The imported bearing and oil seal in the main drive to ensure highly-efficiency,stability and durability.
6. Various of pore diameter spe]]></description><pubDate><![CDATA[20140926]]></pubDate></item>
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<title><![CDATA[China Supplies Garri Fryer Machine in Cassava To Garri Processing Equipment]]></title><link><![CDATA[https://syrupmachine.en.ec21.com/China_Supplies_Garri_Fryer_Machine--10580664_11538271.html]]></link><description><![CDATA[packaging of garri. The whole weighing process is controlled by the computer and automatically packaged. The equipment integrates feeding, metering, weighing, packaging and conveying. It has the char]]></description><pubDate><![CDATA[20220301]]></pubDate></item>
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<title><![CDATA[Fiber Optical Switch]]></title><link><![CDATA[https://meisuoptics.en.ec21.com/Fiber_Optical_Switch--11343598_11513821.html]]></link><description><![CDATA[scale optical transmission. As a mature optical line protection switch
manufacturer, MEISU aims to develop the smallest yet the most reliable industrial fiber optic switches of different package form]]></description><pubDate><![CDATA[20220120]]></pubDate></item>
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<title><![CDATA[Orthotic Latex Memory Foam EVA Insole]]></title><link><![CDATA[https://taiyuanshoesmaterial.en.ec21.com/Orthotic_Latex_Memory_Foam_EVA--11842428_11842431.html]]></link><description><![CDATA[Package
1.Support packaging with OPP bags, PVC bags, POLY bags, PP boxes, PVC boxes, cartons, etc.
2. Depend on buyer request.
Specification
Body:Advanced polyurethane material for shock absorption a]]></description><pubDate><![CDATA[20230908]]></pubDate></item>
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<title><![CDATA[590rpm 37kw Drum Wood Cutting Machine Diesel Powered]]></title><link><![CDATA[https://woodchippermachines.en.ec21.com/590rpm_37kw_Drum_Wood_Cutting--11861952_11861953.html]]></link><description><![CDATA[chipper machine is designed to be robust, durable and efficient, and is ideal for large-scale industrial wood chipping, and is perfect for reducing large logs into small wood chips.
We are confident ]]></description><pubDate><![CDATA[20231102]]></pubDate></item>
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<title><![CDATA[CVD Diamond Heat Sink Thermal]]></title><link><![CDATA[https://yuxindiamond.en.ec21.com/CVD_Diamond_Heat_Sink_Thermal--11585475_11585488.html]]></link><description><![CDATA[chip module large-scale integrated circuit, packaging of semiconductor, etc. The cooling capacity of integrated chip of laser equipment can be enhanced by 30% to 100% with CVD diamond cooling fin.
]]></description><pubDate><![CDATA[20230511]]></pubDate></item>
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<title><![CDATA[BGA Rework Station]]></title><link><![CDATA[https://seamarkzm.en.ec21.com/BGA_Rework_Station--11684896_11684897.html]]></link><description><![CDATA[chip packaging technology, which is applied to improve the performance of digital products and reduce the volume of products through the ball grid array structure. All digital products through this 
]]></description><pubDate><![CDATA[20221202]]></pubDate></item>
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<title><![CDATA[High Frequency Inductor]]></title><link><![CDATA[https://zkhk2023.en.ec21.com/High_Frequency_Inductor--11907973_11907976.html]]></link><description><![CDATA[chip-scale packages. Innovations such as 3D printing, metamaterials, and magnetic materials are also being explored for their potential to further improve high frequency inductor technologies. These ]]></description><pubDate><![CDATA[20240301]]></pubDate></item>

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