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DOCBOND|Conductive Adhesive

DOCBOND|Conductive Adhesive
This product is a single component epoxy conductive adhesive with Conductive material as the medium. It is characterized by high purity, high conductivity, low modulus and long service life. The ...

DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...
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