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DOCBOND|Low Temperature Curing Adhesive

DOCBOND|Low Temperature Curing Adhesive
DB291 This product is a single component, low temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials at lower temperatures and in a ...

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate

DOCBOND|sealant for Gas Path of Fuel Cell Bipolar Plate
The application of this series of products in hydrogen fuel electric reactor is:double plate gas-path adhesive seal,instead of the traditional seal ring This product is a single component,thermally ...
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