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Products > thermal conductivity > Hothree Technology | Similar Products
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thermal conductivity

" in Insulation Materials & Elements found 10 Products from Hothree Technology, China
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Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0

Bergquist Gap Pad HC5.0 GAP PADTGP HC5000 BERGQUIST GPHC5.0
BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal ...

Bergquist Hi-flow 565ut

Bergquist Hi-flow 565ut
BERGQUIST HI-FLOW THF 3000UT Features and Benefits• Thermal impedance: 0.05°C-in.2/W(at 25 psi)• High thermal conductivity: 3.0 W/mk• Phase change softening temperature52°C• Naturally tacky• ...

Loctite 315

Loctite 315
Technology:AcrylicChemical Type:AcrylicAppearance (uncured):Blue pasteComponents:One component - requires no mixingViscosity:HighCure:ActivatorApplication:Bonding Henkel LOCTITE 315 300ML is a ...

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS

BERGQUIST GAP PAD VO Ultra Soft GAP PAD TGP 1000VOUS
BERGQUIST GPVOUS, Thermal Conductive Sheet, Silica Gel Cooling PadGAP PAD TGP 1000VOUS, Silicone Thermal Pad For ConverterGAP PAD VO Ultra Soft Interface Pad Heat Transfer MaterialsBERGQUIST GAP PAD ...

Bergquist Gap Filler Tgf 2000 GF2000

Bergquist Gap Filler Tgf 2000 GF2000
Features and Benefits 1. Thermal conductivity: 2.0 W/m-K2. Ultra-conforming; designed for fragile and low-stress applications 3.Ambient and accelerated cure schedules 4.100% solids – no cure ...

Bergquist Hi Flow Thf 500 Hi-Flow 625

Bergquist Hi Flow Thf 500 Hi-Flow 625
Features and Benefits 1.Thermal impedance: 0.71°C-in2 /W (25 psi) 2.Electrically isolating 3.65°C phase change compound coated on PEN film 4.Tack-free and scratch-resistant BERGQUIST Hi-Flow 625 ...

Bergquist Gap Pad Tgp 7000ulm

Bergquist Gap Pad Tgp 7000ulm
FEATURES AND BENEFITS 1.Thermal Conductivity: 7 W/m-K 2.High-compliance, low compression stress 3.Ultra low modulus PRODUCT DESCRIPTIONA 7 W/m-K, extremely soft Gap Pad with exceptional thermal ...

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S

Bergquist SP900S Sil Pad 900s SIL PAD TSP 1600S
The true workhorse of the SIL PAD product family, SIL PAD900S AC (BERGQUIST SP900S AC)thermally conductive insulation material is designed for a wide variety of applications requiring high thermal ...

Bergquist Sp1500st Sil-pad 1500st

Bergquist Sp1500st Sil-pad 1500st
BERGQUIST SP1500ST(Thermally Conductive Adhesive Tape) is a fiberglass reinforcedthermal interface material that is naturally tacky on both sides.BERGQUIST SIL-PAD 1500ST(Thermally Conductive ...

Laird Tflex 600 Thermal Gap Filler

Laird Tflex 600 Thermal Gap Filler
FEATURES AND BENEFITS • Very high compliancy for low stress applications • 3 W/mK thermal conductivity • Available in thicknesses from 0.020” - 0.200” (0.5mm - 5.0mm) • Naturally tacky, needs no ...
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