EC21, Global B2B Marketplace

Buy Now

Sell Now

My EC21

Search Advanced Search

Products > assembled component > Shenzhen Hsr Technology Co., Ltd. | Similar Products

Your search for "

assembled component

" found 5 Products from Shenzhen Hsr Technology Co., Ltd., China

Inquire Now

(1-5 out of 5)

Bergquist Liqui Form Tlf 10000: high thermal stability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable ...

LOCTITE EA E-60HP 50ml: component, toughened, medium viscosity, industrial grade epoxy adhesive with a long operating time, which, when mixed,.LOCTITE EA E-60HP 50ml cures at room temperature to form a tough, off-white ...

Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000: BERGQUIST GPHC3.0,GAP PAD HC 3.0,GAP PAD TGP HC3000 BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K.The material offers exceptional ...

Laird Tflex 300 Thermal Gap Filler: lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Tflex 300TG is offered with a cut-through resistant Tgard silicone liner. ...

Laird TPCM580 Phase Change Material: components it comesinto contact with. The result is an interface with minimal thermal contact resistance. Due tothe gradual change in viscosity (softening), it minimizes migration (pump-out).The Tpcm ...

Page 1 of 11

Go to Page Go

Share :

Email this page

Browse: Manufacturer Directory Premium Suppliers Site Map

About EC21 Contact Us Terms & Conditions Report Item Online Trading Risks Product Listing Policy

Copyright (c)1997-2025 EC21 Inc. All Rights Reserved. EC21 in KoreanChinese

Business Registry Number: 120-86-03931 | Mall order sales Registration Number: 강남-5838

Inquiry Basket ()