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Bergquist Liqui Form Tlf 10000

Bergquist Liqui Form Tlf 10000
high thermal stability. This material is specially designed to provide effective electronic component cooling capability for 5G base station and remote antenna assembly where a highly reliable ...

Bergquist GPHC3.0 Gap Pad Hc 3.0 Gap Pad Tgp HC3000

Bergquist GPHC3.0 Gap Pad  Hc 3.0 Gap Pad Tgp HC3000
at low pressures due to a unique 3.0 W/m-K filler package and lowmodulus resin formulation. The enhanced material is ideal for applications requiringlow stress on components and boards during ...
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