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Products > c tech > Fujian Huaqing Electronic Material Technology Co.,Ltd. | Similar Products
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" found 11 Products from Fujian Huaqing Electronic Material Technology Co.,Ltd., China
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(1-11 out of 11)

Aluminum Nitride Insulating Ceramic Cheet

Aluminum Nitride Insulating Ceramic Cheet
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Polished Aluminum Nitride Ceramic Disk

Polished Aluminum Nitride Ceramic Disk
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Aln Aluminum Nitride Ceramic Thermal Pads AlN Substrate

Aln Aluminum Nitride Ceramic Thermal Pads AlN Substrate
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Drill Hole AlN Insulating Ceramic

Drill Hole AlN Insulating Ceramic
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

AlN Ceramic Plate or Wafer

AlN Ceramic Plate or Wafer
C to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's hardness - 8 Electrical ...

High Thermal Conductivity AlN Ceramic Insulator

High Thermal Conductivity AlN Ceramic Insulator
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Aluminum Nitride Ceramic Substrate

Aluminum Nitride Ceramic Substrate
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Laser Scribing Aluminum Nitride Ceramic Shim

Laser Scribing Aluminum Nitride Ceramic Shim
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Laser Scribing AlN Ceramic Substrate

Laser Scribing AlN Ceramic Substrate
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...

Dielectric AlN Ceramic Substrate Heat Sink

Dielectric AlN Ceramic Substrate Heat Sink
C) W/m.k ≥170 (20ºC to 300ºC) Thermal expansivity (300ºC to 800ºC) ×10-6/ºC 4.4 ×10-6/ºC 4.8 Mechanical Properties Flexural strength MPa 420 Modulus of elasticity GPa 320 Moh's ...
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