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High Strength MaterialsLightweight Materials High Thermal Conductivity MaterialAl-SiC,Al/SiC

High Strength MaterialsLightweight Materials  High Thermal Conductivity MaterialAl-SiC,Al/SiC
vibration resistance ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal ...

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,

AlSiC,Semiconductor Packaging Substrate,Used for Manufacturing Substrates in Measurement Equipment,
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment

Used for Manufacturing Substrates in Semiconductor Component Manufacturing and Measurement Equipment
vibration resistance ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal ...

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC

Lightweight Materials High Strength Materials High Thermal Conductivity Material Al-SiC,Al/SiC
Advantages -Matching the coefficient of thermal expansion can help reduce thermal stress, improve component reliability and lifespan. -The low-density characteristic gives it an irreplaceable ...

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC

High Power Packaging Materials,Mobile Phone, Tablet, Laptop Heat Dissipation Patch,Al-SiC,AlSiC
vibration resistance ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal ...

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate

Electronic Substrate,,Heat Sinks,Thermal Conductive Material,Al-SiC IGBT Base Plate
AlSiC was first used in the US radar chip substrate to replace tungsten copper. After the replacement, the heat dissipation effect is excellent, and the overall weight loss of the radar is 10 kg, ...

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials

Aluminum Silicon Carbide,AlSiC High Thermal Conductivity for Electronic Packaging Materials
vibration resistance ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal ...

Aluminum Silicon Carbide,AlSiC Is A High-strength and High Thermal Conductivity Ceramic Material

Aluminum Silicon Carbide,AlSiC  Is A High-strength and High Thermal Conductivity Ceramic Material
vibration resistance ensure the stability of components in harsh environments. -High strength and rigidity make it less prone to warping and deformation due to external stress or internal thermal ...
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