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Metal Oxide Semiconductor

Metal Oxide Semiconductor
device shown in the figure has a backgate made of lightly doped P-type silicon. The electrical characteristics of this MOS capacitor can be explained by grounding the backgate and connecting the gate ...

Small Out-Line Package

Small Out-Line Package
devices. SOP Package Type Pin Spacing (mm) Pitch (mm) Size (mm) Lead Count Application SOIC (Small Outline Integrated Circuit) 1.27, 1.57, 2.54 0.65~1.27 3x4~10x20 8~24 Microcontrollers, Memory ...
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