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IC Packaging(IC Assembly,Dummy Components Build)

IC Packaging(IC Assembly,Dummy Components Build)
Standard Systems have been providing Semiconductor Assembly Services to IC design companies or Fabless companies since 1996. We use good sub- contractors in Korea and other Asia area for IC assembly ...

LQFP; Low Profile Quad Flat Package

LQFP; Low Profile Quad Flat Package
LQFP /Low Profile Quad Flat Pack Note : Power Quad 2 & 4 LQFP, ExposedPad LQFP are also available. LQFP : Body Size : Smallest 7mmx7mm, Largest : 28mmx28mm Body Thickness :1.4mm Lead Form : 1.0mm ...

TSOP(I). Thin Small Outline

TSOP(I). Thin Small Outline
Click to enlarge image ( Dummy Component;Mechanical IC ) TSOP(I) / Thin Small Outline (Type I) TSOP(I) : Body Size : Smallest 8x11.8mm, Largest : 12mmx18.4mm Body Thickness :1.0mm Lead Count : ...

PDIP, SPDIP. Dual-In-Line Packages

PDIP, SPDIP. Dual-In-Line Packages
PDIP , SPDIP /(Shrink) Plastic Dual In Line PDIP : 300MIL/ 8LD ~28LD ,400MIL /22LD,600MIL /24LD~48LD SPDIP : 400MIL/ 30LD~32LD,600MIL/ 42LD ~56LD,750MIL/ ...

IC Assembly Services for Fabless Companies

IC Assembly Services for Fabless Companies
Standard Systems, Working at IC Assembly Service company have been providing Semiconductor Assembly Services to IC Design and Fabless companies, and also supplying components to world wide ...
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