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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate: core (alu or copper), PTFE and Ceramic, to fabricate double- and multi-layer circuit boards. Q：What's your packing details? A：We have normal packing method;If you have special requirements,pls let ...

Winfly Double Sidel Copper Foam Clad Laminates Cu PCB Laminate: core (alu or copper), PTFE and Ceramic, to fabricate single-, double- and multi-layer circuit boards. Q：What's your packing details? A：We have normal packing method;If you have special requirements ...

Winfly Single Copper Foam Clad Laminates for Heat Sink: core (alu or copper), PTFE and Ceramic, to fabricate single-, double- and multi-layer circuit boards. Q：What's your packing details? A：We have normal packing method;If you have special requirements ...

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Winfly Single Copper Foam Clad Laminates for Heat Sink CCL Cu PCB Laminate