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<title><![CDATA[EC21 Product Catalogs - hi flow 625]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/hi flow 625.html]]></link><item>
<title><![CDATA[Bergquist Hi Flow Thf 500 Hi-Flow 625]]></title><link><![CDATA[https://echo19820828.en.ec21.com/Bergquist_Hi_Flow_Thf_500--11478029_11501012.html]]></link><description><![CDATA[625 is designed to be used as a thermal interface material between electronic power devices that require electrical isolation and a heat sink.
The reinforcement makes Hi-Flow 625 easy to handle, and ]]></description><pubDate><![CDATA[20240514]]></pubDate></item>

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