EC21 Product Catalogs - lga

LGA 2011 X79 Motherboard Socket PC Computer Sever Desktop Intel Xeon E5 CPU 4 DDR3 64GB RAM Mother

20250310

LGA 2011Country of Origin Guangdong, ChinaPackaging YesWith CPU NoMemory Slot 4 DDR3 DIMMsCPU Type IntelMemory Channel Quad ChannelChip Manufacturer IntelHard Disk Interface SATA, M.2Brand Linkoncept

LGA4189-004 Air Cooler & CPU Cooler &DC IAC/EC/Cooling Fans

20231007

Intel Xeon E3-1275 V5 3.4GHz Quad-Core LGA1151 CPU Processor 1275V5

20220916

INTEL XEON CPU * E3-1275V5 CM8066201934909 SR2LK 4 Cores Intel Xeon Server CPU * Intel Xeon CPU Silver 4210R Processor for servers and workstations * 3rd Generation Processor Intel Xeon Gold 6348 CPU

Intel Core I7-13700KF CPU 8P+8E/24T LGA1700 125W 3.4-5.4GHz 30MB L3

20230209

CPU Clock 3.4 GHz - 5.4 GHz L2 Cache 24MB TDP 125w Warranty 1 Years CPU Cores 8P+8E Lithography 10 nm L3 Cache 30MB Packaging Details Tray Package Brand Intel Line Intel Core i7 CPU Threads 24T Produ

GA-965GM-DS2 LGA 775 VGA Sound SATA-II RAID GBit LAN 4x DDR2 PC2-6400 Motherboard Refurbished

20150718

GA-965GM-DS2 LGA 775 VGA Sound SATA-II RAID GBit LAN 4x DDR2 PC2-6400 motherboard Refurbished Mdel: GA-965GM-DS2 Package Weight: 2kg Package Size: 25*25*7cm

Concrete Blade

20260330

LGA300 3.2mm 10mm 1”,20mm 14”(350mm) LGA350 3.2mm 10mm 1”,20mm 16”(400mm) LGA400 3.2mm 10mm 1”,20mm 18”(450mm) LGA450 3.6mm 10mm 1”,20mm 20”(500mm) LGA500 3.6mm 10mm 1”,20mm Feature

VOGT FESTA Frypan From Korea

20260330

(Durable to 260degree)2. Coating: TITANIUM COAT + lLLITE 6layer coat3. General packing plan:Poly vinyl, foam paper & 10pcs/CTN4. Remark-OEM Available-TUV(LGA) Passed(Coating)-ISO 9001:14001 acquire

Gold Ceramic CPU Scrap

20241209

LGA 775 Brand Name INTEL PRO Place of Origin United States of America Product Name CPU Processor Scrap Main Frequency 3.0GHz Warranty 1 Year Condition Used Working Memory Types DDR3 1333 1600 Intel

Hot Selling Quality Ceramic CPU Scrap for Gold Recovery with Pins

20241025

LGA 1366Brand Name:Gold ceramic cpuPlace of Origin:GermanyProduct Name:I9-9900KName:Used CPUPackage:Tray PackageWarranty:1 YearMain Frequency:2.93GHzCPU Series:Xeon Gold 6200Condition:100% OrginalDel

In Stock Ceramic CPU Scrap High Grade CPU Scrap Computers Cpus / Processors/ Chips

20241021

Shape: Block Processor brand: Intel Type : Double Sided Gold CPU Technique: Plated Slot type: LGA 775 Manufacturing: 45 nm The second level cache: 2 MB The number of core: dual core double thread The

PowerEdge R860 Rack Server

20241010

LGA 4677 MEMORY Memory Slots: 64 x DDR5 DIMM slots Memory Speed: Up to 4800MHzMaximum Memory Configuration: 16TB RDIMM DRIVE BAYS Front Bays:Up to 8 x 2.5-inch SAS/SATA (HDD/SSD) drives max 122.88 T

UM981

20240401

LGA Dimension 17.0 × 22.0 × 2.6 mm Weight 1.91 g ± 0.03 g Environmental Specifications Working temperature -40 °C ~ +85 °C Storage Temperature -55 °C ~ +95 °C Humidity 95% No condensation Vibr

8~19 Inch Industrial Panel PC Touch Screen

20210618

Processor (6M Cache, up to 3.60 GHz) Intel® Core™ i7-3770 Processor (8M Cache, up to 3.90 GHz) Other LGA1155 socket CPUTags: 12.1 inch industrial panel pc, 12.1 inch panel pc with touch screen

CSM GPS/Glonass Receiver Module NV08C-CSM

20200601

GPS, GLONASS, GALILEO, COMPASS, SBAS L1 signals Compact LGA 20x26x2.5 mm design for SMT assembly Navigation and Time synchronization applications 32 GNSS tracking channels Assisted GNSS option suppor

Ops 2024

20240122

LGA1151 CPU Intel standard interface OPS-C+, compatible with OPS-C Support MSATA system disk, fast startup, one button reset to enhance the user's experience Silent double-roller copper fin Thermal M

Brand New X79 Motherboard Support E5-2660

20170517

product description Model: X79 The CPU interface: LGA2011 The main structure: ATXWhether display output: not support More graphics support: does not support Memory type: DDR3 Memory channel: f

Good Working PCBA for Electronics

20230519

LGA PCB Testing E-Test, Flying Probe test Acceptable File Formate Gerber, Auo CAD'S, Pro-E,Ki-CAD Quality Standards IPC-A-600F and MIL-STD-105D, China GB<4588>

Cooling Hekang 9225 12V 3P 2200RPM CPU Aluminum Radiator

20240219

型号：HK9225L12如下： DC92x92x25mm 风扇CPU存储; 液压轴承 12V 0.18A ， 2200RPM， 40.87CFM ， 26.8dBA.3针风扇形状：圆形散热片材质：铝 CPU插槽：Intel LGA1200， LGA1

Universal Reballing Device

20141112

LGA52/60,BGA,QFN/QFP,TSOP,etc. Memory Tester For DDR, Including DDR2, DDR3 And DDR4. Clip Connector For FPC/FFC. POP/BGA Reballing Service, Reballing Kit And Reballing Machine. Programming Device

Ultra Low Humidity Dry Cabinet for MSD IPC/JEDEC J-STD-033

20181025

LGA, FBGA, LFBGA, TFBGA, CGA, CCGA, μBGA, LLP Drying and storage of multi-layer PCB and PWB before and after mounting, including dual side boards awaiting second side reflow. Moisture controlled

SIMCOM SIM808 2G Module

20181130

MU509 PCIE MU709 LGA MU709 PCIE MU736 MU739 EVDO EM660 MC509 PCIE MC509 LGA TD MT509 LTE MU909-521 PCIE MU909-521 LGA ME936 ME906C ME909S-821 PCIE ME909S-821 LGA

SY101-s04rh-4b-G2

20230414

LGA1151 and other processors. On the storage, the system supports SATA 3.5-inch/2.5-inch hard drives. Green Power Through optional specific drive model with MAID technology, it can greatly reduce sys

Computerised Bga Rework Station DH-G600

20230913

LGA、Micro SMD、MLF...) Lead and Lead-free II. Parameters Power(Max) 5500W Top heater 1200W Bottom heater 2nd 1200W, 3rd IR heater 3000W Power supply 220/110V 50/60Hz Top hot air flow speed be ab

Iot 4g Module

20230707

LGA Storage Optional (ROM: 2 Gb / 1 Gb; RAM: 1 Gb) Interface PCM/I2S ADC x 2 I2C x 1 (Open) SPI x 1 (Open) UART x 2 USB 2.0 PWRKEY_N RESET_N DTR (sleep mode control) NET_LIGHT USIM (1.8 V / 3.0 V) SG

Power Graphics H510I-M

20230828

LGA1200 10/11th CPU TDP: 65W. Thin ITX's memory is DDR4 2400MHz/2666MHz/2933MHz Max: 64G and has 2×DDR4 SO-DIMM Memory Slot. Expansion: 1×MXM (A: DP, B: HDMI), WIFI Slot: 1×M.2 2230 (Support WIFI/

Wholesale Computer CPU / Processor Scrap

20190621

part number BX80614E5620 (SLBVC) Frequency (MHz) 2667 Bus speed (MHz) 2933 MHz QPI Package 1366-land Flip-Chip Land Grid Array (FC-LGA10) Socket 1366 (LGA1366) Size 1.77" x 1.67" / 4.5cm x 4.25cm

CPU Cooler

20240102

Model: HK9225L12 as follows : DC92x92x25mm Fan CPU Heatsink; Hydraulic Bearing 12V 0.18A , 2200RPM, 40.87CFM , 26.8dBA. 3Pin Fan Shape：Circular Heat Sink Material:Aluminum CPU Socket:Intel LGA1200,

Mother Board

20160407

LGA771 for Intel® Xeon® Processor 51XX / 52XX / 53XX / 54XX Series (Optional) 1. LGA775 for Intel® Core™ 2 Extreme quad‐core / Core™ 2 Extreme dual‐core / Core™ 2