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<channel>
<title><![CDATA[EC21 Product Catalogs - module bonder]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/module bonder.html]]></link><item>
<title><![CDATA[Piotec Smart Card Making Machine]]></title><link><![CDATA[https://piotecglobal.en.ec21.com/Piotec_Smart_Card_Making_Machine--11883003_11941753.html]]></link><description><![CDATA[module strip, chip electrical performance test, chip initialization and other operations.
In the intelligent card system manufacturing industry, we can provide equipment for the whole process (includ]]></description><pubDate><![CDATA[20240524]]></pubDate></item>
<item>
<title><![CDATA[Semiconductor Plastic Encapsulation System / Fully Automatic Plastic Sealing System]]></title><link><![CDATA[https://llp6258280.en.ec21.com/Semiconductor_Plastic_Encapsulation_System_Fully--11840944_11840953.html]]></link><description><![CDATA[modules (MAX). Automatic loading and unloading module (option)
Features
1. Optimal for various kinds of LED packages with variable quantity production
2. Tuoxin proprietary compression molding method]]></description><pubDate><![CDATA[20230903]]></pubDate></item>

</channel>
</rss>