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<title><![CDATA[EC21 Product Catalogs - resin dice]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/resin dice.html]]></link><item>
<title><![CDATA[Hubless Resin Diamond Dicing Blade for Semiconductor]]></title><link><![CDATA[https://robertlong.en.ec21.com/Hubless_Resin_Diamond_Dicing_Blade--9365138_9365151.html]]></link><description><![CDATA[Resin diamond dicing blade 
Features: High Processing Quality For Cutting Of Hard, Brittle Material, 
Able To Precisely Control Diamond Concentration, 
To Achieve Cutting Quality; Improved Cut Qualit]]></description><pubDate><![CDATA[20180105]]></pubDate></item>
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<title><![CDATA[Diamond Dicing Blade for Motherboard Grooving]]></title><link><![CDATA[https://jason3162.en.ec21.com/Diamond_Dicing_Blade_for_Motherboard--11775343_11795955.html]]></link><description><![CDATA[Brief
Introductions:
Type:
1A1R
Bond:
Resin or Metal
Application:
Glass (optical
devices, fiber optics), quartz (optical splitters, saw devices), LiTa03
LiNb03 (devices), QFN （copper epoxy molding ]]></description><pubDate><![CDATA[20230524]]></pubDate></item>
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<title><![CDATA[Metal Bond Diamond Wheel]]></title><link><![CDATA[https://egrindwheel.en.ec21.com/Metal_Bond_Diamond_Wheel--11777670_11777671.html]]></link><description><![CDATA[Resin Bond Grinding Wheels
Henan E-Grind Abrasives Co., Ltd&apos;s Resin cubic boron nitride grinding wheel
consist of resin(phenolic or polyimide), fillers, either diamond or CBN, and wheel cores.
Vitrif]]></description><pubDate><![CDATA[20230427]]></pubDate></item>
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<title><![CDATA[Cast Zinc Alloy Polyhedral Dice Set]]></title><link><![CDATA[https://sunnyliang1991.en.ec21.com/Cast_Zinc_Alloy_Polyhedral_Dice--10862154_10862250.html]]></link><description><![CDATA[CNC machine dice, resin dice, acrylic dice, dice tray, etc.
7. Package: opp bag and carton
8. Feature: caged dice
9. Color: as customer&apos;s demands
10. Sample: available
11. Related products:
]]></description><pubDate><![CDATA[20190806]]></pubDate></item>
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<title><![CDATA[Semiconductor / Double Side Tape]]></title><link><![CDATA[https://daehyunsthq.en.ec21.com/Semiconductor_Double_Side_Tape--11495972_11496008.html]]></link><description><![CDATA[resin bleed, mold flashLead Frame PI TapeFilm Assist MoldingPrevent resin bleed, mold flashSilicone &amp; Thermoplastic adhesive availableGradeFilm TypeThickness(㎛)Single/Double sidedPeelStrength(A)Pee]]></description><pubDate><![CDATA[20211221]]></pubDate></item>
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<title><![CDATA[Melamine Moulding Compound Melamine Urea Formaldehyde Resin Powder]]></title><link><![CDATA[https://angelwang07153828.en.ec21.com/Melamine_Moulding_Compound_Melamine_Urea--11415614_11499253.html]]></link><description><![CDATA[Melamine moulding compound, commonly known as electric jade. It is composed of anino resin as matrix and produced by adding curing agent, filling agnet, release agent, pigment, etc. Amino molding pla]]></description><pubDate><![CDATA[20230710]]></pubDate></item>

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