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<title><![CDATA[EC21 Product Catalogs - semiconductor substrate]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/semiconductor substrate.html]]></link><item>
<title><![CDATA[Aluminum Heatsink,Aluminum Base,Thermal Substrate,Semiconductor Packaging Materials,Al-SiC,AlSiC]]></title><link><![CDATA[https://hygdkj.en.ec21.com/Aluminum_Heatsink_Aluminum_Base_Thermal--12057378_12058647.html]]></link><description><![CDATA[Semiconductor packaging
-Automotive industry
-EADS
-Optical system Precision Instrument
-Racing engine pushrods
-AlSiC box structure parts
-Robot engine putters
-Helicopter accessories
Henan Hanyin O]]></description><pubDate><![CDATA[20260613]]></pubDate></item>
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<title><![CDATA[308nm 254nm 190nm UV Bandpass Filter for Excimer Laser]]></title><link><![CDATA[https://meticulab.en.ec21.com/308nm_254nm_190nm_UV_Bandpass--12070016_12070972.html]]></link><description><![CDATA[substrate, size, and blocking depth.
🔹 Reliable Quality Each batch includes measured spectral transmittance curve report.
📊 Technical Specifications
Parameter
Specification
Custom Range
Center ]]></description><pubDate><![CDATA[20260429]]></pubDate></item>
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<title><![CDATA[High Precision Film Fined Resistors]]></title><link><![CDATA[https://xy-resistor.en.ec21.com/High_Precision_Film_Fined_Resistors--12069996_12070002.html]]></link><description><![CDATA[substrate. This technology enables precise control over resistance values and enhances the overall performance and reliability of the resistors.
Compact SizePrecision thin film resistors are availabl]]></description><pubDate><![CDATA[20260605]]></pubDate></item>
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<title><![CDATA[Photoresist Coating Machine PCBA Custom PCBA Assembly Service]]></title><link><![CDATA[https://tecoopcba.en.ec21.com/Photoresist_Coating_Machine_PCBA_Custom--12055074_12055051.html]]></link><description><![CDATA[substrate + IP65 sealing) and intelligent process optimization. It is suitable for production lines of major Korean manufacturers such as Samsung and SK Hynix, supports EtherCAT communication and SEM]]></description><pubDate><![CDATA[20260429]]></pubDate></item>
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<title><![CDATA[Hot Press Laminate TPX Film (Adhesive Barrier Release Film)]]></title><link><![CDATA[https://pipiluluha.en.ec21.com/Hot_Press_Laminate_TPX_Film--12047105_12047238.html]]></link><description><![CDATA[cleaning steps.
4. 
Low Thermal Expansion : Matched thermal expansion coefficient with substrates (e.g., metal, ceramic, PCB) prevents bonding failure due to deformation at high temperatures.
]]></description><pubDate><![CDATA[20250306]]></pubDate></item>
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<title><![CDATA[TiOx NbOx Cr2O3 Al2O3 YSZ Y2O3/YOF/YF3/YAG for Plasma Spray Coating]]></title><link><![CDATA[https://crownre2008.en.ec21.com/TiOx_NbOx_Cr2O3_Al2O3_YSZ--11957443_11985958.html]]></link><description><![CDATA[substrate material and minimizing the risk of material failure.
In addition to its excellent thermal and environmental protection properties, YSZ is also resistant to thermal shock, abrasion, and ero]]></description><pubDate><![CDATA[20240815]]></pubDate></item>
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<title><![CDATA[Monocrystalline Silicon Wafer]]></title><link><![CDATA[https://czboyan.en.ec21.com/Monocrystalline_Silicon_Wafer--11964559_11964560.html]]></link><description><![CDATA[substrates, molecular beam epitaxial growth substrates, X-ray analysis of crystalline semiconductors
Our premium Monocrystalline Silicon Wafer offers unmatched cost performance. Despite its superior ]]></description><pubDate><![CDATA[20240707]]></pubDate></item>
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<title><![CDATA[Atmospheric Plasma Cleaning System Chain Conveyor]]></title><link><![CDATA[https://atvplasma.en.ec21.com/Atmospheric_Plasma_Cleaning_System_Chain--11960396_11963494.html]]></link><description><![CDATA[bonding processes.
Application fields:
Suitable for PCBs, IC substrates, LEDs, LCDs, PV batteries, semiconductors, PTFE, automotive interior parts, medical equipment, plastic and rubber products.
]]></description><pubDate><![CDATA[20240705]]></pubDate></item>
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<title><![CDATA[Thermal Insulation Materials]]></title><link><![CDATA[https://ziitek2024.en.ec21.com/Thermal_Insulation_Materials--11960680_11960702.html]]></link><description><![CDATA[substrate, the performance meets the requirements, the installation is convenient, the work efficiency is improved, and the labor cost is greatly reduced.
Features
&gt; Highly compliant surface characte]]></description><pubDate><![CDATA[20240701]]></pubDate></item>
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<title><![CDATA[Advanced Materials Market &amp; Chemical Industry Research Reports]]></title><link><![CDATA[https://bisresearch14022014.en.ec21.com/Advanced_Materials_Market_Chemical_Industry--11941123_11941144.html]]></link><description><![CDATA[semiconductors, ceramics, polymers converted into substrates, metalized film conductors, etc. 
A comprehensive insight that includes market intelligence, competitive benchmarking, and key development]]></description><pubDate><![CDATA[20240624]]></pubDate></item>
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<title><![CDATA[As Cut SiC Wafer Manufactuer for Polishing Testing]]></title><link><![CDATA[https://homrayma.en.ec21.com/As_Cut_SiC_Wafer_Manufactuer--9361467_11941349.html]]></link><description><![CDATA[substrate is the cornerstone of GaN and SiC application in the third generation semiconductor materials. Due to the limitation of technology and process level, large-scale application of GaN material]]></description><pubDate><![CDATA[20240523]]></pubDate></item>
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<title><![CDATA[Ball Lenses]]></title><link><![CDATA[https://jtoptic.en.ec21.com/Ball_Lenses--11940832_11940836.html]]></link><description><![CDATA[substrate of glass and can focus or collimate light, depenging upon the geometry of the input source. Half-ball lenses are also common and can be interchanged with full ball lenses if the physical co]]></description><pubDate><![CDATA[20240522]]></pubDate></item>
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<title><![CDATA[AccuThermo AW Series Rapid Thermal Processing]]></title><link><![CDATA[https://allwin21.en.ec21.com/AccuThermo_AW_Series_Rapid_Thermal--9759759_9763379.html]]></link><description><![CDATA[Substrate.Continue Reading
AccuThermo AW820M RTPby Atmospheric Rapid Thermal Process, Rapid Thermal Process Equipment
AccuThermo AW 820 RTP, 150-840 C or 400-1250 C. 1-6 gas lines with MFCs. Small sa]]></description><pubDate><![CDATA[20240514]]></pubDate></item>
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<title><![CDATA[Rotary Ceramic Sputtering Target]]></title><link><![CDATA[https://acetron6.en.ec21.com/Rotary_Ceramic_Sputtering_Target--11928897_11928903.html]]></link><description><![CDATA[substrate material. The bombarded solid is the raw material for deposition of thin film materials by sputtering method, which is called the sputtering target
.If you need any information or a quote p]]></description><pubDate><![CDATA[20240424]]></pubDate></item>
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<title><![CDATA[Constant Acceleration Tester]]></title><link><![CDATA[https://cmetechnology.en.ec21.com/Constant_Acceleration_Tester--11925572_11925579.html]]></link><description><![CDATA[substrate attachment, and other elements of the microelectronic device. By establishing proper stress levels, it may also be employed as an in-line 100 percent screen to detect and eliminate devices ]]></description><pubDate><![CDATA[20240416]]></pubDate></item>
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<title><![CDATA[A-Plane Sapphire Colloidal Silica]]></title><link><![CDATA[https://polishingslurry.en.ec21.com/A_Plane_Sapphire_Colloidal_Silica--11825051_11921634.html]]></link><description><![CDATA[Substrate is a kind of extremely hard semiconductor substrates, Kona engineering developed Sphere Substrate Polishing Slurry, including colloidal silica and alumina slurry.
In most cases, diamond abr]]></description><pubDate><![CDATA[20240407]]></pubDate></item>
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<title><![CDATA[Ceramic Substrate]]></title><link><![CDATA[https://blueskycs8.en.ec21.com/Ceramic_Substrate--5461106_7090952.html]]></link><description><![CDATA[Material for alumina ceramic substrate :95-99 Alumina Application: widely used in the electronics industry thick-film circuit, large-scale integrated circuits, mixed IC, semiconductor packaging, chip]]></description><pubDate><![CDATA[20120916]]></pubDate></item>
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<title><![CDATA[Quartz Sight Glass]]></title><link><![CDATA[https://dynaflex52.en.ec21.com/Quartz_Sight_Glass--3159123_3164136.html]]></link><description><![CDATA[substrate for projection masks for photolithography.
Due to the thermal stability and composition it is used in the semiconductor fabrication furnaces.
Fused quartz has nearly ideal properties for fa]]></description><pubDate><![CDATA[20081201]]></pubDate></item>
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<title><![CDATA[Silicon Wafers, Silicon Substrates]]></title><link><![CDATA[https://sapphiresbstrate.en.ec21.com/Silicon_Wafers_Silicon_Substrates--10457818_10458249.html]]></link><description><![CDATA[Crystal Material
Silicon
Growth Method
CZ or FZ
Diameter
2 inch
4 inch
6 inch
50.8&amp;plusmn; 0.1mm
100&amp;plusmn;0.2mm
150.0&amp;plusmn;0.2 mm
Thickness
275&amp;plusmn;25&amp;micro;m
525&amp;plusmn;20&amp;mu;m
675&amp;plusmn;25&amp;]]></description><pubDate><![CDATA[20170706]]></pubDate></item>
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<title><![CDATA[AAA Solar Simulator Solar Cell IV Test]]></title><link><![CDATA[https://aulight2021.en.ec21.com/AAA_Solar_Simulator_Solar_Cell--11446867_11446869.html]]></link><description><![CDATA[substrate testing and evaluation, cosmetics, coatings, light resistance experiments of various materials, photobiological Inspection and testing, surface defect analysis and other fields.The solar si]]></description><pubDate><![CDATA[20221027]]></pubDate></item>
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<title><![CDATA[100% High Purity F46 Liquid/FEP Liquid/FEP Aqueous Dispersion for Dipping and Anti-sticking Coating]]></title><link><![CDATA[https://dina2022.en.ec21.com/100_High_Purity_F46_Liquid--11564050_11564125.html]]></link><description><![CDATA[substrates in various end use applications; Filtration, Architectural Roofing, Electronics, Semiconductor, Food Processing, Packaging and other end use components requiring a high performance fluorop]]></description><pubDate><![CDATA[20220510]]></pubDate></item>
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<title><![CDATA[LED Chip,Ceramic Substrate,Ceramic Metallization,Ceramic DPC,Ceramic DBC,Thin Film Ceramic Substrate]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/LED_Chip_Ceramic_Substrate_Ceramic--11797353_11797389.html]]></link><description><![CDATA[substrate 2. Microwave (Wireless Communication &amp; Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate
For more]]></description><pubDate><![CDATA[20240117]]></pubDate></item>
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<title><![CDATA[3D Printing Services]]></title><link><![CDATA[https://greatlight001.en.ec21.com/3D_Printing_Services--11610218_11619992.html]]></link><description><![CDATA[semiconductor properties of the material transfer to the substrate, so as to create electronic devices.
Popular Processing Technology: SLA, SLM, MJF
Popular Material: Titanium alloy, Alumination allo]]></description><pubDate><![CDATA[20220823]]></pubDate></item>
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<title><![CDATA[CMP Slurry Abrasive]]></title><link><![CDATA[https://bestchem00.en.ec21.com/CMP_Slurry_Abrasive--6027922_6027942.html]]></link><description><![CDATA[semiconductor fabrication for planarizing the top surface of an in-process semiconductor wafer. In CMP process, the semiconductor substrate is polished by metal-oxide slurry using elastomer pad. Acco]]></description><pubDate><![CDATA[20160127]]></pubDate></item>
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<title><![CDATA[MO1 99.95%min Polished Surface Molybdenum Target]]></title><link><![CDATA[https://bjsymetal.en.ec21.com/MO1_99.95_min_Polished_Surface--8359167_8651665.html]]></link><description><![CDATA[substrate, then argon atoms and electrics were ionized .The electrics fly to the substrate while argon atoms accelerate to bomb the target, the neutral atoms (or molecules) in the target deposit on t]]></description><pubDate><![CDATA[20140131]]></pubDate></item>
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<title><![CDATA[Optical Sapphire Windows]]></title><link><![CDATA[https://23494059302940394039.en.ec21.com/Optical_Sapphire_Windows--9446894_8334557.html]]></link><description><![CDATA[substrates, sapphire lens, sapphire prisms, sapphire &amp; ruby ball, sapphire rods, sapphire laser sticks, and special sapphire components, etc. The product is mainly applied in mechanical instrumentati]]></description><pubDate><![CDATA[20190715]]></pubDate></item>
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<title><![CDATA[LD66/77 Polyurethane Polishing Pad for Glass]]></title><link><![CDATA[https://robertlong.en.ec21.com/LD66_77_Polyurethane_Polishing_Pad--9365138_9365139.html]]></link><description><![CDATA[substrate glass etc. LD66 is characterized with good flexible and long durable life, the polishing yield rate can reach to 98%, LD77 has a better 
cutting force and higher polishing efficiency. 
(2).]]></description><pubDate><![CDATA[20150122]]></pubDate></item>
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<title><![CDATA[Semiconductor Alcohol Sensor TGS2620]]></title><link><![CDATA[https://lieen1216.en.ec21.com/Semiconductor_Alcohol_Sensor_TGS2620--10136102_10140972.html]]></link><description><![CDATA[semiconductor layer formed 
on an alumina substrate of a sensing chip together with an integrated heater. 
In the presence of a detectable gas, the sensor&amp;#39;s conductivity increases 
depending on t]]></description><pubDate><![CDATA[20160906]]></pubDate></item>
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<title><![CDATA[High Efficieney/Abundant Inventory/Free Sample White Fused Alumina for Refractory Material]]></title><link><![CDATA[https://joshua123xinli.en.ec21.com/High_Efficieney_Abundant_Inventory_Free--11839201_11839215.html]]></link><description><![CDATA[substrate.
Particle Size and IngredientsJIS:240#,280#,320#,360#,400#,500#,600#,700#,800#,1000#,1200#,1500#,2000#,2500#,3000#,3500#,4000#,6000#,8000#,10000#,12500# EN:F240,F280,F320,F360,F400,F500,F60]]></description><pubDate><![CDATA[20230829]]></pubDate></item>
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<title><![CDATA[DOVMXtech 50L 100L Double Layer Chemical Reactor Jacketed Decarboxylation Stainless Steel Reactor]]></title><link><![CDATA[https://dovmxtech.en.ec21.com/DOVMXtech_50L_100L_Double_Layer--11876260_11876263.html]]></link><description><![CDATA[substrate, adding cellulase, and adding lactic acid bacteria, the reaction temperature is 45 ℃, the pH value is 4.8 ‑ 5.0, and the reaction time is 72 ‑ 96 hours to produce lactic acid.
DOVMXte]]></description><pubDate><![CDATA[20231216]]></pubDate></item>
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<title><![CDATA[ZnTe Crystal]]></title><link><![CDATA[https://dientech.en.ec21.com/ZnTe_Crystal--10711776_11600621.html]]></link><description><![CDATA[semiconductor. Its Zinc telluride crystal substrate structure is cubic, like that for sphalerite and diamond.
Zinc telluride(ZnTe) is a non-linear optical photorefractive material of possible use in ]]></description><pubDate><![CDATA[20240124]]></pubDate></item>
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<title><![CDATA[Aluminum Nitride Sheet]]></title><link><![CDATA[https://attelements.en.ec21.com/Aluminum_Nitride_Sheet--11822808_11854509.html]]></link><description><![CDATA[dissipation are often a problem. The series of excellent characteristics are considered to be the ideal materials for highly concentrated semiconductor substrates and electronic device packaging.
]]></description><pubDate><![CDATA[20231014]]></pubDate></item>
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<title><![CDATA[Semiconductor / Double Side Tape]]></title><link><![CDATA[https://daehyunsthq.en.ec21.com/Semiconductor_Double_Side_Tape--11495972_11496008.html]]></link><description><![CDATA[t is excellent for surface protection of substrates such as wafers in semiconductor, backgrinding and dicing processes.
Daehyunst is providing special, high-performance tapes according to the diversi]]></description><pubDate><![CDATA[20211221]]></pubDate></item>
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<title><![CDATA[Metal Sputtering Target]]></title><link><![CDATA[https://longhuatech.en.ec21.com/Metal_Sputtering_Target--11825682_11857776.html]]></link><description><![CDATA[substrate to produce thin films required for various industrial applications, including electronics, optics, and magnetic storage, among others. Metal sputtering targets play an essential role in the]]></description><pubDate><![CDATA[20231023]]></pubDate></item>
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<title><![CDATA[CMP Polishing Slurry FInal Polishing Liquid]]></title><link><![CDATA[https://grs51653168.en.ec21.com/CMP_Polishing_Slurry_FInal_Polishing--11567436_11570581.html]]></link><description><![CDATA[semiconductor materials
(ex. Si, Ge, GaAs, InP, SiC, GaN, AlN), stainless steel, aluminum magnesium alloy and compound crystal
etc.
Applications:
Silicon carbide 
substrate, Sapphire · LED 
material]]></description><pubDate><![CDATA[20231024]]></pubDate></item>
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<title><![CDATA[PLC Control IC Chip Molding Machine]]></title><link><![CDATA[https://semiconductormolding.en.ec21.com/PLC_Control_IC_Chip_Molding--11895700_11895701.html]]></link><description><![CDATA[Semiconductor Packaging Performance Parameters● Mold closing pressure: 98-1764kN;● Injection pressure: 4.9-30kN adjustable;● Applicable leadframe/substrate size: width 20-90mm, length 100-300mm]]></description><pubDate><![CDATA[20240131]]></pubDate></item>
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<title><![CDATA[Chip Design Verification]]></title><link><![CDATA[https://s2c1.en.ec21.com/Chip_Design_Verification--11743791_11831229.html]]></link><description><![CDATA[What is Chip Design？
Integrated circuits (IC), often called chips, combine multiple discrete electronic devices onto a single substrate utilizing the capabilities of semiconductor materials. The de]]></description><pubDate><![CDATA[20230808]]></pubDate></item>
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<title><![CDATA[Mini Pleat ULPA Air Filter U15-U16]]></title><link><![CDATA[https://snyli.en.ec21.com/Mini_Pleat_ULPA_Air_Filter--11643903_11657577.html]]></link><description><![CDATA[substrates, this filter is water resistant and high air flow.
Our ULPA filter panels are intended for terminal filtration in a wide range of applications, including cleanrooms and semiconductor fabri]]></description><pubDate><![CDATA[20221017]]></pubDate></item>
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<title><![CDATA[IC Chips]]></title><link><![CDATA[https://zkhk2023.en.ec21.com/IC_Chips--11907973_11907981.html]]></link><description><![CDATA[semiconductor wafers or dielectric substrates, and then packaged in a tube. Inside the shell, it becomes a miniature structure with the required circuit functions. IC chips are the basic building blo]]></description><pubDate><![CDATA[20240301]]></pubDate></item>
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<title><![CDATA[Germanium Window, Silicon Window ,IR Window]]></title><link><![CDATA[https://ruikeoptics000.en.ec21.com/Germanium_Window_Silicon_Window_IR--11732883_11874188.html]]></link><description><![CDATA[substrate is more sensitive to
temperature changes, and the transmission properties of germanium are extremely
sensitive to temperature changes, the higher the temperature, the lower the
transmittanc]]></description><pubDate><![CDATA[20231209]]></pubDate></item>
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<title><![CDATA[Aluminum Nitride Ceramics Structural Parts]]></title><link><![CDATA[https://middiaceramics305.en.ec21.com/Aluminum_Nitride_Ceramics_Structural_Parts--11863537_11869504.html]]></link><description><![CDATA[substrate has extremely high thermal conductivity, non-toxic, corrosion resistance, high temperature resistance, good thermochemical stability, etc. It is an ideal packaging material and heat dissipa]]></description><pubDate><![CDATA[20231123]]></pubDate></item>
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<title><![CDATA[20W 30W 50W CO2 Laser Engraving Marking Machine PCB Code CO2 Marking Machine From China]]></title><link><![CDATA[https://jgh67890.en.ec21.com/20W_30W_50W_CO2_Laser--11852776_11852814.html]]></link><description><![CDATA[components, PCB flexible circuit board, ceramic substrate, semiconductor, crystal glass, plastic connectors, silicone rubber keys, SMD components and other materials on the graphic engraving.
]]></description><pubDate><![CDATA[20231010]]></pubDate></item>

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