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<title><![CDATA[EC21 Product Catalogs - sic wafer]]></title>
<link><![CDATA[https://www.ec21.com/ec-market/sic wafer.html]]></link><item>
<title><![CDATA[SiC Wafer Manufacturer Best Price 6 Inch SiC Wafer]]></title><link><![CDATA[https://homrayma.en.ec21.com/SiC_Wafer_Manufacturer_Best_Price--9361467_11994138.html]]></link><description><![CDATA[Purchasing low cost 6 inch SiC Wafer from HMT SiC Substrate Wafer Manufacturer in China. We offer D grade R grade and P grade 6 inch SiC Substrate for 4H polytype Conductive type. Our 6 inch SiC Wafe]]></description><pubDate><![CDATA[20240829]]></pubDate></item>
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<title><![CDATA[SiC Wafer Boat]]></title><link><![CDATA[https://semicorex.en.ec21.com/SiC_Wafer_Boat--11768850_11768859.html]]></link><description><![CDATA[Introducing our high-quality SiC Wafer Boat, designed to provide a reliable solution for wafer processing in various industries. These ceramic pedestals are manufactured using high-purity ceramics, w]]></description><pubDate><![CDATA[20230413]]></pubDate></item>
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<title><![CDATA[Silicon Carbide Arm for Wafer Moving in Semiconductor SiC End Effector]]></title><link><![CDATA[https://cersol85363528972.en.ec21.com/Silicon_Carbide_Arm_for_Wafer--11868364_11872468.html]]></link><description><![CDATA[Ceramic
robotic arm plays a role in handling in semiconductor equipment. It is 
equivalent to the hand of the robot of the semiconductor equipment and 
is responsible for carrying wafer silicon chips]]></description><pubDate><![CDATA[20231201]]></pubDate></item>
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<title><![CDATA[EFEM/Sorter]]></title><link><![CDATA[https://qztqzt.en.ec21.com/EFEM_Sorter--11907826_11907827.html]]></link><description><![CDATA[wafers through continuous deep learning. Honghu equipment has been widely used in the field of silicon-based integrated circuit manufacturing and compound semiconductors such as SiC and GaN.
]]></description><pubDate><![CDATA[20240531]]></pubDate></item>
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<title><![CDATA[AccuThermo AW 610M Rapid Thermal Process]]></title><link><![CDATA[https://allwin21.en.ec21.com/AccuThermo_AW_610M_Rapid_Thermal--9759759_9763380.html]]></link><description><![CDATA[SiC and other valuable compound material wafers .
Wafer Size: 2 to 4 inch or 3~6 inch, Silicon wafers. Use 3″/4″/6″ Susceptor or wafer carriers for small samples, compound material (GaAs , InP ]]></description><pubDate><![CDATA[20240514]]></pubDate></item>
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<title><![CDATA[SiSiC Silicon Carbide Cantilever Paddle Beam Use in Semiconductor Wafer Processing]]></title><link><![CDATA[https://zhijing.en.ec21.com/SiSiC_Silicon_Carbide_Cantilever_Paddle--11843767_11843867.html]]></link><description><![CDATA[wear for a long timsic cantilever paddle applicationsThe sic cantilever paddle delivers sic boats / quartz boats which carry silicon wafers into the high temperature diffusion coating furnace tube.
]]></description><pubDate><![CDATA[20230912]]></pubDate></item>
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<title><![CDATA[Polycrystalline Diamond Polishing Slurry Grinding Polishing Liquid]]></title><link><![CDATA[https://grs51653168.en.ec21.com/Polycrystalline_Diamond_Polishing_Slurry_Grinding--11567436_11570443.html]]></link><description><![CDATA[SiC wafer, Hard disk, Hard ceramic, Optical glass &amp; crystal, Sealing ring
ModelGrit sizeWater baseOil basePC-6-WPC-6-O6µmPC-4-WPC-4-O4µmPC-3-WPC-3-O3µmPC-2-WPC-2-O2µmPC-1-WPC-1-O1µmPC-N500-WPC-N]]></description><pubDate><![CDATA[20231024]]></pubDate></item>
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<title><![CDATA[Quartz Blanks]]></title><link><![CDATA[https://freqcontrol.en.ec21.com/Quartz_Blanks--10693822_10693849.html]]></link><description><![CDATA[Sic); Polished(Cerium oxide）and &amp; etched Std 
Overtone
Fundamental; Third Overtone (3rd); Fifth Overtone (5th)
Contouring (Diopter)
Plano-Convex: 0.5 Diopter ～ 10 Diopter Bi-Convex: 10 Diopter ]]></description><pubDate><![CDATA[20190319]]></pubDate></item>
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<title><![CDATA[Anti-adhesion Surface Treatment, Paint and Coating]]></title><link><![CDATA[https://ceramicpcb.en.ec21.com/Anti_adhesion_Surface_Treatment_Paint--11797314_11797317.html]]></link><description><![CDATA[SiC processing skills in 2013, brought to industry for Industry Solutions graphite material itself to the dust contamination of the buffer zone. Surface materials：Al2O3, ZrO2, Y2O3, SiO2, PTFE, DCS]]></description><pubDate><![CDATA[20240117]]></pubDate></item>

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